STMicroelectronics-IEMN Joint Laboratory
ST-IEMN at a glance - Click here
LEAF EQUIPEX Project
LEAF EQUIPEX at a glance - Click here
IPCEI ME-CT Advanced Functional Packaging for RF and mmW
IEMN-IPCEI-ME-CT SP08 - Advanced Functional Packaging for RF and mmW
ERC Starting Grant UPTEG - "Unconventional Principles of ThermoElectric Generation".
IPCEI ME-CT Distributed AI
IEMN-IPCEI-ME-CT SP02 - Ultra-low power distributed artificial intelligence circuits for autonomous sensors
Event Driven Artificial Intelligence Hardware for Biomedical Sensors
Sustainable Technologies Enabling Future Telecom Applications
ANR LEOPAR
EFFICACE - Electrical eFFects on InterfaCiAl thermal resistanCE 2021-2025 HANIBAL - Heat Management in the Ballistic Limit: Phononic Crystals and Thermal Rectification 2021-2024