The packaging centre covers a dedicated area of 260m2, in the immediate vicinity of the IEMN clean room. This centre offers access to a number of specialised tools dedicated to packaging the final component.
Packaging processes involve shaping the chips (thinning, polishing and cutting) and assembling them using bonding and electrical interconnection processes. These steps enable the component to be interfaced to make it functional, leading to a first level of prototyping.
Since 2016, the cluster has had two laser microstructuring facilities obtained from EQUIPEX LEAF, whose research programmes focused on advanced functional packaging for electronics, photonics and BioMEMs systems.
Room 1
Chip and wafer shaping
Room 2
Laser microstructuring
Room 2
