Etching and plasma treatment
Chemical vapor etching
Ion beam etching
Ion implantation
Wet etching and chemical surface preparation
With 10 plasma etching reactors (ICP-RIE, RIE, DRIE, IBE) and 2 dry chemical etching reactors (HF vapour and XeF2), the Engraving is a major piece of equipment at the Micro Nano Fabrication plant. Wet chemical etching of a wide range of materials is also carried out here. The division's expertise extends to the etching of various families of materials: Si, III-V, insulators (SixNySiO2), various alloys (Al2O3TiN, VN) and metals (Au, Pt). A significant part of the activity is dedicated to the deep etching of Si for the production of MEMS components, microstructures for energy storage and RF/THz components.
Contact:
Dmitri YarekhaHead of Engraving Division
Timothey Bertrand, Laurent Fugère, Jean Houpin, David Troadec, Gisuseppe Di Gioia