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PLATEFORME : CENTRALE DE MICRO NANO FABRICATION
Slide thumbnailPLATEFORME : CENTRALE DE MICRO NANO FABRICATION
PLATEFORME : CENTRALE DE MICRO NANO FABRICATION
PLATEFORME : CENTRALE DE MICRO NANO FABRICATION

Collage

Thermal or anodic bonding (Suss MicroTec SB6e) with alignment allows for thermocompression or anodic bonding of substrates from 1 to 4 inches. We perform proximity (200µm spacer) or contact bonding of substrates with an alignment accuracy of 1 to 3 µm depending on material constraints. The use of a graphite pad (500µm) minimizes stresses and bonding can be performed under N2 purge or secondary vacuum.

Expertise and know-how: some highlights

- Thermocompression adhesive bonding of aromatic epoxy resins. Use for microfluidics, swicth cap, MEMs, optoelectronics...

 1.  Bonding Glass / BCB/ Si (200µm)/ BCB/ Glass for microfluidics (Biomems group)

– Metal bonding (low T° or T° 340°C)

-Au/Au diffusion (340°C) for via-hole interconnection in microfluidics, MEMs

-Au, Cu bonding for transfer of materials (GaN, GaAs, InP, LiNbO3..) on Si, GaAs or stainless steel.

-Low T° Ti/Au bonding (200°C) for the transfer of materials (GaAs, InP...) on Si.

-In/In bonding for THz components

2. Transfer of a porous membrane (100nm pores) of 64µm thickness on Si by Ti/Au layer (Aiman group)

- Si/pyrex or Si/Pyrex/Si type anodic bonding with or without Via, used especially in microfluidics

3. Anodic bonding (silicon/glass): creation of a microfluidic channel (Biomems group).

Expertise and know-how: other

  • Molecular Si/Si bonding with activation plasma under O2
  • Parylene/SiO2 bonding with O2 activation plasma
  • CMNF - Micro and Nano Fabrication Center
    • CMNF Staff
    • Deposits and epitaxy division
      • Chemical Vapour Deposition (CVD)
      • Physical Vapour Deposition (PVD)
      • Inkjet printing
      • Heat tratments
      • Chemical synthesis and surface functionalisation
      • Epitaxial growth
    • Lithography Unit
      • Electronic Lithography
      • Optic Lithography
      • 2D laser lithography
      • Collage
    • Engraving and implantation pole
      • Etching and plasma treatment
      • Deep etching of silicon
      • Chemical vapor etching
      • Ion beam etching
      • Focused Ion Beam
      • Ion implantation
      • Wet etching and surface preparation
    • In Line Analysis Unit
      • Structural characterizations
      • Electrical properties
      • Propriétés optiques et spectroscopies
      • Microscopy Topography Morphology
      • Faisceau / beam
    • Soft Lithography and Bio Microfluidics
      • Soft lithography
      • BioMicroFluidics
    • Packaging Division
      • Shaping chips and wafers
      • Component assembly
      • Precision machining
  • PCMP - Multi-Physics Characterization Platform
    • PCMP Staff
    • Scanning Probe Microscopy Facility
      • Air Domain
      • UHV domain
    • Hyperfrequency, Optical and Photonic Characterization (CHOP)
      • Spectroscopy
      • Static - Small signal - Noise
      • Power
      • Nano characterisation
      • MEMS
      • Microwave photonics
      • Millimetre and THz
      • Temperature measurements
    • Characterisation of COMmunicating Systems and Prototyping cluster (SigmaCOM)
      • Analog and digital communication systems
        • Energy efficiency test bench
        • Multifunctional analogue and digital I/O devices
        • Software-defined radio
        • Telecom test bench
      • Optical communication systems
      • Prototypage (SigmaCom – C2EM)
        • Design Modelling
        • Programming
        • Achievements
        • Tests & Measurements
    • Characterisation, ElectroMagnetic Compatibility and Prototyping Centre (C2EM)
      • Anechoic chamber
      • TEM cell
      • Reverberation chamber with mode mixing
      • MaMIMOSA
      • Measurement Zt
  • Services offered by our platforms
    • services of the Bio Micro Fluidic platform
    • Services of the CMNF platform
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Cité Scientifique
Avenue Henri Poincaré
CS 60069
59 652 Villeneuve d'Ascq Cedex, France
Tel : 03 20 19 79 79
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