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PLATEFORME : CENTRALE DE MICRO NANO FABRICATION
Slide thumbnailPLATEFORME : CENTRALE DE MICRO NANO FABRICATION
PLATEFORME : CENTRALE DE MICRO NANO FABRICATION
PLATEFORME : CENTRALE DE MICRO NANO FABRICATION

Wet etching and surface preparation

Chemistry areas

Grouped in 2 rooms, 17 workstations with laminar flow dedicated to families of chemical products allow the use of acids, bases, solvents, resins,... to perform a large number of operations on substrates such as

  • Selective wet etching, anisotropic or isotropic, controlled slow etching, release of micro/nanostructures or active surface transfers, lift off, creation of nanowires by etching, creation of porous silicon,...
  • Surface cleaning: organic/metallic/particulate decontamination, surface preparation, deoxidation, megasonic cleaning,...

The first room is particularly adapted for silicon technology because of its thermostatically controlled wet etching baths (KOH, TMAH) and its VLSI products. The second room, initially designed for III/V compounds, is now used for the whole range of substrates.

Know-how: some highlights

  • Anisotropic etching of silicon with KOH through an etching mask

KOH etching of a tilted grating in silicon, 54.75° angle (opto group).

  • Controlled etching of III/V materials

Release of microstructures by wet etching III/V (Anode group)

  • CMNF - Micro and Nano Fabrication Center
    • CMNF Staff
    • Deposits and epitaxy division
      • Chemical Vapour Deposition (CVD)
      • Physical Vapour Deposition (PVD)
      • Inkjet printing
      • Heat tratments
      • Chemical synthesis and surface functionalisation
      • Epitaxial growth
    • Lithography Unit
      • Electronic Lithography
      • Optic Lithography
      • 2D laser lithography
      • Collage
    • Engraving and implantation pole
      • Etching and plasma treatment
      • Deep etching of silicon
      • Chemical vapor etching
      • Ion beam etching
      • Focused Ion Beam
      • Ion implantation
      • Wet etching and surface preparation
    • In Line Analysis Unit
      • Structural characterizations
      • Electrical properties
      • Propriétés optiques et spectroscopies
      • Microscopy Topography Morphology
      • Faisceau / beam
    • Soft Lithography and Bio Microfluidics
      • Soft lithography
      • BioMicroFluidics
    • Packaging Division
      • Shaping chips and wafers
      • Component assembly
      • Precision machining
  • PCMP - Multi-Physics Characterization Platform
    • PCMP Staff
    • Scanning Probe Microscopy Facility
      • Air Domain
      • UHV domain
    • Hyperfrequency, Optical and Photonic Characterization (CHOP)
      • Spectroscopy
      • Static - Small signal - Noise
      • Power
      • Nano characterisation
      • MEMS
      • Microwave photonics
      • Millimetre and THz
      • Temperature measurements
    • Characterisation of COMmunicating Systems and Prototyping cluster (SigmaCOM)
      • Analog and digital communication systems
        • Energy efficiency test bench
        • Multifunctional analogue and digital I/O devices
        • Software-defined radio
        • Telecom test bench
      • Optical communication systems
      • Prototypage (SigmaCom – C2EM)
        • Design Modelling
        • Programming
        • Achievements
        • Tests & Measurements
    • Characterisation, ElectroMagnetic Compatibility and Prototyping Centre (C2EM)
      • Anechoic chamber
      • TEM cell
      • Reverberation chamber with mode mixing
      • MaMIMOSA
      • Measurement Zt
  • Services offered by our platforms
    • services of the Bio Micro Fluidic platform
    • Services of the CMNF platform
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Cité Scientifique
Avenue Henri Poincaré
CS 60069
59 652 Villeneuve d'Ascq Cedex, France
Tel : 03 20 19 79 79
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