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PLATEFORME : CENTRALE DE MICRO NANO FABRICATION
Slide thumbnailPLATEFORME : CENTRALE DE MICRO NANO FABRICATION
PLATEFORME : CENTRALE DE MICRO NANO FABRICATION
PLATEFORME : CENTRALE DE MICRO NANO FABRICATION

2D laser lithography

The laser lithography is done with a Dilase 650 machine (Kloé).

The laser source with a wavelength of 375 nm allows writing with most optical resins on any type of substrate (mask blank, semiconductor, glass, polymer, crystal, flexible film...). The samples can go from a few mm² to 4 inches. The minimum pattern resolution is slightly less than a micron.

Expertise and know-how: some highlights

- Prototyping, non-contact writing and no optical mask, useful for developing processes before making an optical mask.

  1. SPR220 2µm sur silicium (équipe CSAM)

 

- High aspect ratios, the laser's depth of field allows for high aspect ratios, useful for example for microchannels

2. 1µm wide cross, AZ15nXT 8µm resin on silicon

- Grayscale, the ability to vary the power received by the resin allows for 3D structuring of the resin during development

3. 1µm steps every 100µm with 4µm of SPR220 resin on silicon

 

Expertise and know-how: other

  • Writing on flexible substrates
  • Writing on highly structured samples
  •  …
  • CMNF - Micro and Nano Fabrication Center
    • CMNF Staff
    • Deposits and epitaxy division
      • Chemical Vapour Deposition (CVD)
      • Physical Vapour Deposition (PVD)
      • Inkjet printing
      • Heat tratments
      • Chemical synthesis and surface functionalisation
      • Epitaxial growth
    • Lithography Unit
      • Electronic Lithography
      • Optic Lithography
      • 2D laser lithography
      • Collage
    • Engraving and implantation pole
      • Etching and plasma treatment
      • Deep etching of silicon
      • Chemical vapor etching
      • Ion beam etching
      • Focused Ion Beam
      • Ion implantation
      • Wet etching and surface preparation
    • In Line Analysis Unit
      • Structural characterizations
      • Electrical properties
      • Propriétés optiques et spectroscopies
      • Microscopy Topography Morphology
      • Faisceau / beam
    • Soft Lithography and Bio Microfluidics
      • Soft lithography
      • BioMicroFluidics
    • Packaging Division
      • Shaping chips and wafers
      • Component assembly
      • Precision machining
  • PCMP - Multi-Physics Characterization Platform
    • PCMP Staff
    • Scanning Probe Microscopy Facility
      • Air Domain
      • UHV domain
    • Hyperfrequency, Optical and Photonic Characterization (CHOP)
      • Spectroscopy
      • Static - Small signal - Noise
      • Power
      • Nano characterisation
      • MEMS
      • Microwave photonics
      • Millimetre and THz
      • Temperature measurements
    • Characterisation of COMmunicating Systems and Prototyping cluster (SigmaCOM)
      • Analog and digital communication systems
        • Energy efficiency test bench
        • Multifunctional analogue and digital I/O devices
        • Software-defined radio
        • Telecom test bench
      • Optical communication systems
      • Prototypage (SigmaCom – C2EM)
        • Design Modelling
        • Programming
        • Achievements
        • Tests & Measurements
    • Characterisation, ElectroMagnetic Compatibility and Prototyping Centre (C2EM)
      • Anechoic chamber
      • TEM cell
      • Reverberation chamber with mode mixing
      • MaMIMOSA
      • Measurement Zt
  • Services offered by our platforms
    • services of the Bio Micro Fluidic platform
    • Services of the CMNF platform
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Cité Scientifique
Avenue Henri Poincaré
CS 60069
59 652 Villeneuve d'Ascq Cedex, France
Tel : 03 20 19 79 79
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