Lithography Unit

The lithography resource represents a pillar in the manufacturing technology of many components manufactured at the IEMN and is therefore in constant interaction with the other resources of the plant. It is composed of a complete set of equipment spread over 3 rooms. A room with inactinic light allows preparation, coating, annealing and development. A second room allows optical exposure (UV or deepUV) linked to bonding (thermocompression or anodization) and laser lithography. One room is dedicated to electronic lithography.

Six spinners with specific solvent routing allow the coating of a panel of more than 50 variants of optical or electronic resins obtained by dilution or distillation. The latter allow the realization of micron to submicron patterns (UV, laser) and up to 10nm in electronic lithography. Specific annealing processes (programmed ramps, proximity annealing) are also used to control the stresses or adhesion of the resins. The equipment can process substrates ranging from 4-5 mm to 4 inches in a wide range of materials (metals, semiconductors, glass, polymers, flexible substrates, ceramics...).