This activity aims to develop a new generation of instrumentation to address on-wafer measurement of nano-devices in the microwave regime.

Micro-probing tools for high frequency measurement of Nano-devices

This activity aims to develop a new generation of instrumentation to address on-wafer measurement of nano-devices in the microwave regime. The system consists of a scanning electron microscope equipped with XYZ nano-positioners and micro-electromechanical systems (MEMS) technology-based miniaturized microwave ground-signal-ground (GSG) probes. The probe structure is designed using coplanar technology on a micrometer scale. In contrast to conventional macroscopic on-wafer probing structures, a 2μm width signal line and 2.5μm width spacing between signal and ground conductors are achieved (Fig. 11). The micro-cantilever-based probe structure is optimized to ensure good radio frequency (RF) performances. The fabrication steps of the probe structures have been developed by means of MEMS technologies using silicon-on-insulator (SOI) wafers. This activity started with EQPX ExCELSiOR project (Nov.2012 - Dec.2019) and followed by European PlanarCal project (Nov. 2015-Oct. 2018).This federative work is performed in collaboration with several key actors and groups at IEMN, particularly CSAM, NAM6 groups.

Fig. 11 : On-wafer micrometer pitch probing set-up