STMicroelectronics-IEMN Joint Laboratory
ST-IEMN at a glance – Click here
LEAF EQUIPEX Project
LEAF EQUIPEX at a glance – Click here
IPCEI ME-CT Advanced Functional Packaging for RF and mmW
IEMN-IPCEI-ME-CT SP08 – Advanced Functional Packaging for RF and mmW
ERC Starting Grant UPTEG – "Unconventional Principles of ThermoElectric Generation"
IPCEI ME-CT Distributed AI
IEMN-IPCEI-ME-CT SP02 – Ultra-low power distributed artificial intelligence circuits for autonomous sensors
Event Driven Artificial Intelligence Hardware for Biomedical Sensors
Sustainable Technologies Enabling Future Telecom Applications
ANR LEOPAR
EFFICACE – Electrical eFFects on InterfaCiAl thermal resistanCE 2021-2025 HANIBAL – Heat Management in the Ballistic Limit: Phononic Crystals and Thermal Rectification 2021-2024