PE-CVD cold process

Contact : Christiane LEGRAND

OXFORD Plasmalab 80Plus (new in 2007)

  • top electrode RF driven (13.56MHz and 50-400KHz)
  • film stress can be controlled by high/low frequency mixing techniques
  • silicon nitride, oxide deposition
  • gases used : SiH4 in N2, NH3, N2O, N2 and He
  • deposition temperature : 100 –  340 °C
  • deposition rate : 100 to  650 …/mn

Bâti OXFORD Plasmalab 80 Plus 1

Bâti OXFORD Plasmalab 80 Plus 2