Metallic films

Metallic films

Materials

Ag, Al, Au, Cr, Ge, In, Mo, Ni, Pd, Pt, Ti, W

Synthesis

Electron –gun – RT:
Up to 4 inch wafers : Ag, Mo
Up to 6 inch wafers : Al, Au, Cr, Ge, Ni, Pd, Pt, Ti
DC and RF sputtering –  up to 4 inch wafers – 5.10-2 to 4.10-3 mbar : Al, Au, Cr, Mo, Ni, Pt, Ti, W
Joule effect – RT – up to  4 inch wafers”: In
ALD – 300°C – up to 8 inch wafers : Pt

Mastering
Complete

Applications

Electrodes, contacts, reflective layer, etching mask, interfaces for organic molecules, adhesion layer, Seebeck effect, catalyst, substrate soldering

Characterisation

Profilometry, SEM, sheet resistance

Partnership

LNE, Renatech, C2N, EU projects PLANARCAL, MMAMA, TEMMT


Au nanoparticles

Au nanoparticles

Materials
Au nanoparticle (NPs) layers with thiol or amine ligands

Synthesis
Auto assembling of NPs in a compact network forming a Langmuir film at water surface transferred on a substrate by dip coating or transfer printing – 1-3 cm – NP size typically 10 nm

Mastering
Partial

Applications
Surface functionalization, sensors, memories, electronic and optoelectronic properties, catalysis

Characterisation
SEM, AFM, UV, FTIR, XPS

Partnership
Angers and Paris Universities