Metallic films
Metallic films
Materials
Ag, Al, Au, Cr, Ge, In, Mo, Ni, Pd, Pt, Ti, W
Synthesis
Electron –gun – RT:
Up to 4 inch wafers : Ag, Mo
Up to 6 inch wafers : Al, Au, Cr, Ge, Ni, Pd, Pt, Ti
DC and RF sputtering – up to 4 inch wafers – 5.10-2 to 4.10-3 mbar : Al, Au, Cr, Mo, Ni, Pt, Ti, W
Joule effect – RT – up to 4 inch wafers »: In
ALD – 300°C – up to 8 inch wafers : Pt
Mastering
Complete
Applications
Electrodes, contacts, reflective layer, etching mask, interfaces for organic molecules, adhesion layer, Seebeck effect, catalyst, substrate soldering
Characterisation
Profilometry, SEM, sheet resistance
Partnership
LNE, Renatech, C2N, EU projects PLANARCAL, MMAMA, TEMMT
Au nanoparticles
Au nanoparticles
Materials
Au nanoparticle (NPs) layers with thiol or amine ligands
Synthesis
Auto assembling of NPs in a compact network forming a Langmuir film at water surface transferred on a substrate by dip coating or transfer printing – 1-3 cm – NP size typically 10 nm
Mastering
Partial
Applications
Surface functionalization, sensors, memories, electronic and optoelectronic properties, catalysis
Characterisation
SEM, AFM, UV, FTIR, XPS
Partnership
Angers and Paris Universities
