Background: Foldable, thin, light-weight, stackable, high performance – that’s the promise that flexible electronics and integration of highly heterogeneous functional and structural materials holds today. Smart systems featuring ubiquitous intelligence such as wireless sensor networks, micro-aerial vehicles, embedded defense, security and biomedicine chips, environment monitoring and smart textiles are all applications that flexible electronics and heterogeneous integration would make take off. To realize that objectives, microsystems (comprising digital, embedded memories and analogue signal processing), RF circuitry, antennas, sensors, actuators and microfluidics need to be developed. In that context, IEMN develops a flagship research project on flexible electronics featuring the two distinctive trademarks: i) high performance multi-Ghz flexible electronics ii) heterogeneous integration of smart materials and functional blocks onto mechanically flexible/stretchable substrates. In support to this scientific/technological program, the LEAF Equipex platform provides innovative laser-based micro-patterning techniques.

Description of work: The overall objective is to develop alternative placement and bonding technologies of thinned high frequency chip (100 µm² large and 10 µm thick) on flexible substrates. In particular the work aims at designing zero-newton placement and bonding strategies of thin semiconductor chips onto plastic foils. To do so the candidate will have to integrate state of the art knowledge on (i) surface energy modification by geometric and chemical modification and on (ii) interplay between capillary and elastic forces between flexible thin film and liquid droplets. The work will be performed in the clean-rooms of IEMN where state of the art equipments are available (see website) to study and optimize wafer grinding and surface texturing processing steps and to set-up and to characterize microfluidic experiments [1-4]. Special emphasis will be put on polymer coating of hydrophobic substrate, on conformal flattening of semiconductor micro-sheets onto plastic foils and on the use of surface tension and elasticity gradients for chip self-placement.

Duration: 18 months appointment available immediately – start date before 1^st January 2014

Salary: ~2350-2500€ gross/month, ~1950-2050€ net/month according to profile

Location: Institut d’Electronique, de Microélectronique et de Nanotechnologie – IEMN, Villeneuve d’Ascq (F)

Requested qualification: Ph.D. in micro-nanotechnologies with strong experience in polymer science, microfluidics and clean-room processing. Proficiency in flexible electronics is an advantage.

Contact: Please send a complete including publication list and a motivation letter by email to vincent.senez@isen.iemn.univ-lille1.fr

V. Senez
IEMN – UMR-CNRS 8520
Cité Scientifique – Avenue Poincaré BP 60069
VILLENEUVE D’ASCQ CEDEX, F-59652 France
www.iemn.univ-lille1.fr
http://leaf-equipex.iemn.univ-lille1.fr
Phone : +33 (0)3 20 19 78 55

Background: Foldable, thin, light-weight, stackable, high performance – that’s the promise that flexible electronics and integration of highly heterogeneous functional and structural materials holds today. Smart systems featuring ubiquitous intelligence such as wireless sensor networks, micro-aerial vehicles, embedded defense, security and biomedicine chips, environment monitoring and smart textiles are all applications that flexible electronics and heterogeneous integration would make take off. To realize that objectives, advanced very thin film and flexible/conformable electronics and microsystems comprising digital, embedded memories and analogue signal processing, RF circuitry, antennas, sensors, actuators, microfluidics need to be developed. In that context, IEMN develops a flagship research project on flexible electronics featuring two distinctive trademarks: i) high performance multi-Ghz flexible electronics ii) heterogeneous integration of smart materials and functional blocks onto mechanically flexible/stretchable substrates. In support to this scientific/technological program, the LEAF Equipex platform provides innovative laser-based micro-patterning techniques.

Description of work: The overall objective is to develop the mechanically flexible and/or stretchable flavor of wireless sensor nodes (WSN) in collaboration with a major player of the microelectronics industry. Starting from a pre-defined WSN architecture comprising on-the-shelf state-of-the-art components (microcontroller, RF front-end module, energy micro-source, antenna, sensors), ultimate chip thinning, placing, bonding and laser structured interconnects will be combined to yield a compact and mechanically compliant module. Special emphasis will be put on the development of high-frequency assembly solutions compatible with high data rate wireless links. Work carried out at the WSN level will also serve as a test bed for a further miniaturization step to enable the on-board integration of control, communication and sensing electronics into a micro-drone prototype for autonomous navigation. The candidate will take an active role in the orientation of this part of the project and be expected to write scientific article and participle at international conferences.

Duration: 18 months appointment available immediately – start date before 1^st January 2014

Salary: ~2350-2500€ gross/month, ~1950-2050€ net/month according to profile

Location: Institut d’Electronique, de Microélectronique et de Nanotechnologie – IEMN, Villeneuve d’Ascq (F)

Requested qualification: Ph.D. in one of the following areas: electrical Engineering, microelectronics or micro-nanotechnologies with strong experience in clean room processing. Knowledge of flexible electronics would be an advantage.

Contact: Please send a complete CV including publication list and a motivation letter by email to emmanuel.dubois@isen.iemn.univ-lille1.fr

E. Dubois
IEMN – UMR-CNRS 8520
Cité Scientifique
Avenue Poincaré BP 60069
VILLENEUVE D’ASCQ CEDEX, 59652 France
www.iemn.univ-lille1.fr
http://leaf-equipex.iemn.univ-lille1.fr
Phone : +33 (0)3 20 19 79 16

Object: 12 months Position of post-doc for electromagnetic characterization of interconnections used with flexible substrates.

Job description: The successful candidate will participate to studies for electromagnetic characterization of substrates dedicated to flexible electronics and to interconnects high frequency characterization. The work will focus on the development and implementation of protocols for extraction of electromagnetic parameters of interconnects from different S-parameter measurements on a wide frequency range (1 MHz -100GHz). The candidate is expected to develop or adapt tools for the characterization and simulation of the different structures studied. The final goal is to propose design rules for the fabrication process optimization and the performance enhancement of interconnects on flexible substrates. The work involves simulation, realization and characterization aspects. This position is sponsored by the CPER CIA (Contrat de Plan Etat Région Campus de recherche en Intelligence Ambiante).

Position availability: November 2013

Candidate profile: We expect the candidate to have strong skills in
– microwave design and measurements
– EM simulation (HFSS, COMSOL,…)
– computational electromagnetics (FDTD, finite element,…)
– programming
Experience in Cleanroom processes would also be appreciated.

Please send your CV and motivations by email to:
Dr. P.Y.Cresson (pierre-yves.cresson@iemn.univ-lille1.fr)
Prof. T. Lasri (tuami.lasri@iemn.univ-lille1.fr – Tel: (33)3 20 19 79 38)
IEMN – UMR-CNRS 8520
University of Lille 1
Avenue Poincaré BP 60069
VILLENEUVE D’ASCQ CEDEX, F-59652