Scanning electronic microscopy

Contact : Christophe BOYAVA

Watching and validation of laboratory nanoscale processes

The electron beam technology  allow to view and  dimensionner devices,  which the waist is  order of ten  nanometers.

The surface or  cleft cutting view is possible on every insulated materials ( resins, oxides or nitrides) or conductors (Si or III/V substrat , metallizations,. )

The  range accelerations  voltage ( 200V to 30kV ) allows all view without metallization in court of process

Equipment : ULTRA 55  Zeiss

Electron Gun :  FEG ( field effect gun)

Features :

  • Acceleration Voltage 200 V -30 kV
  • Resolutions 1.7 nm at 1 kV and 1 nm at 15 kV
  • Magnification 20X to 900 000X
  • 2 Secondary detectors:  INLENS and External
  • 2 backscratted detectors: QBSD and EsB
  • stage 130 mm by 130 mm

 

Ultra 55

Supra 55 V

Electron Gun :  FEG ( field effect gun)

Features :

  • Acceleration Voltage 200 V -30 kV
  • Resolutions 1.7 nm at 1 kV and 1.5 nm at 15 kV
  • Magnification 20X to 900 000X
  • 2 Secondary Detectors :  INLENS / External
  • 1 VPSE Detector
  • stage 130 mm by 130mm

 

SUPRA 55 VP

Spectroscopie par dispersion en énergie X

Spectroscopie par dispersion en énergie X - 1Spectroscopie par dispersion en énergie X - 2

EBSD

EBSD