{"id":48856,"date":"2021-12-08T10:17:55","date_gmt":"2021-12-08T08:17:55","guid":{"rendered":"https:\/\/www.iemn.fr\/articles-temporaires-anglais\/des-membranes-suspendues-usinees-par-ablation-laser-pour-booster-les-performances-des-circuits-radiofrequences-2.html"},"modified":"2021-12-09T16:35:29","modified_gmt":"2021-12-09T14:35:29","slug":"des-membranes-suspendues-usinees-par-ablation-laser-pour-booster-les-performances-des-circuits-radiofrequences-2","status":"publish","type":"post","link":"https:\/\/www.iemn.fr\/en\/newsletter\/des-membranes-suspendues-usinees-par-ablation-laser-pour-booster-les-performances-des-circuits-radiofrequences-2.html","title":{"rendered":"Suspended membranes machined by laser ablation to boost the performance of radio frequency circuits"},"content":{"rendered":"<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-2ql690r-e3526bf4312d183ad0e9d5e6110b59dd\">\n.flex_column.av-2ql690r-e3526bf4312d183ad0e9d5e6110b59dd{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-2ql690r-e3526bf4312d183ad0e9d5e6110b59dd av_one_full  avia-builder-el-0  el_before_av_hr  avia-builder-el-first  first flex_column_div av-zero-column-padding'     ><section  class='av_textblock_section av-kwx9fg2f-620b1240208ae545042cda8e4edfc346'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><h3 style=\"text-align: center;\">Suspended membranes machined by laser ablation to boost the performance<br \/>\nof radio frequency circuits<\/h3>\n<\/div><\/section><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kwz21o6x-d94753d254b3f33cd2dd3a91d88a3eee\">\n#top .hr.hr-invisible.av-kwz21o6x-d94753d254b3f33cd2dd3a91d88a3eee{\nheight:1px;\n}\n<\/style>\n<div  class='hr av-kwz21o6x-d94753d254b3f33cd2dd3a91d88a3eee hr-invisible  avia-builder-el-2  el_after_av_one_full  el_before_av_one_full'><span class='hr-inner'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1wrppbf-97b79571a96822a8227a89943dcdd208\">\n.flex_column.av-1wrppbf-97b79571a96822a8227a89943dcdd208{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-1wrppbf-97b79571a96822a8227a89943dcdd208 av_one_full  avia-builder-el-3  el_after_av_hr  el_before_av_textblock  first flex_column_div av-zero-column-padding'     ><section  class='av_textblock_section av-kwx9gt5g-ac0bc975c435b3d28b29529886ca22ef'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><blockquote>\n<p><strong>Driven since the 70's by the monolithic miniaturization of transistors (More-Moore era), then consolidated by the second wind of microsystems in the mid-90's (More-than-Moore era), the electronics industry is now facing a new challenge, that of autonomous, functional and miniaturized systems, giving birth to the 'System Moore' paradigm.<\/strong><br \/>\n<strong>In this context, laser machining completes the portfolio of microstructuring processes by occupying the dimensional gap between the micron and the millimeter that microelectronic processes leave vacant. This experimental study shows how laser ablation allows the suspension of radio frequency chips in ultra-thin membranes, giving them exceptional electrical performance gains.<\/strong><\/p>\n<\/blockquote>\n<\/div><\/section><\/div>\n<section  class='av_textblock_section av-kwxaltyd-870ae7394a5441247c146410777dc992'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><hr \/>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-13ewzjw-624ccb7a8158fcee8a63f32bf5f84be9\">\n.av_font_icon.av-13ewzjw-624ccb7a8158fcee8a63f32bf5f84be9{\ncolor:#800000;\nborder-color:#800000;\n}\n.av_font_icon.av-13ewzjw-624ccb7a8158fcee8a63f32bf5f84be9 .av-icon-char{\nfont-size:30px;\nline-height:30px;\n}\n<\/style>\n<span  class='av_font_icon av-13ewzjw-624ccb7a8158fcee8a63f32bf5f84be9 avia_animate_when_visible av-icon-style- avia-icon-pos-left avia-icon-animate'><span class='av-icon-char' aria-hidden='true' data-av_icon='\ue80b' data-av_iconfont='entypo-fontello' ><\/span><\/span>Arun Bhaskar, Justine Philippe, Flavie Braud, Etienne Okada, Vanessa Avramovic, Jean-Francois Robillard, Cedric Durand, Daniel Gloria, Christophe Gaquiere, and Emmanuel Dubois, Large-area femtosecond laser milling of silicon employing trench analysis, OPTICSAND LASER TECHNOLOGY 138 (2021).<\/p>\n<\/div><\/section>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kwz20kd6-0cc3f8757e87a607a5db3123d2faee67\">\n#top .hr.hr-invisible.av-kwz20kd6-0cc3f8757e87a607a5db3123d2faee67{\nheight:1px;\n}\n<\/style>\n<div  class='hr av-kwz20kd6-0cc3f8757e87a607a5db3123d2faee67 hr-invisible  avia-builder-el-7  el_after_av_textblock  el_before_av_one_half'><span class='hr-inner'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1laaauj-0f632c6fb1a9508c5b33e1ed93761d09\">\n.flex_column.av-1laaauj-0f632c6fb1a9508c5b33e1ed93761d09{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-1laaauj-0f632c6fb1a9508c5b33e1ed93761d09 av_one_half  avia-builder-el-8  el_after_av_hr  el_before_av_one_half  first flex_column_div av-zero-column-padding'     ><section  class='av_textblock_section av-kwx9jdm8-e4f451ebf847f5ea1c7cf35e4d33e1e7'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-13ewzjw-a235a21bea60534439757d9f11956514\">\n.av_font_icon.av-13ewzjw-a235a21bea60534439757d9f11956514{\ncolor:#800000;\nborder-color:#800000;\n}\n.av_font_icon.av-13ewzjw-a235a21bea60534439757d9f11956514 .av-icon-char{\nfont-size:20px;\nline-height:20px;\n}\n<\/style>\n<span  class='av_font_icon av-13ewzjw-a235a21bea60534439757d9f11956514 avia_animate_when_visible av-icon-style- avia-icon-pos-left avia-icon-animate'><span class='av-icon-char' aria-hidden='true' data-av_icon='\ue810' data-av_iconfont='entypo-fontello' ><\/span><\/span><strong><span style=\"color: #800000;\">Laser machining closes the \u00b5m-mm gap<\/span><\/strong><br \/>\nUltra-compact systems, such as smartphones or smartwatches, integrate a host of components and sensors covering dozens of communication, signal processing and detection functions. These components are, in most cases, from dissimilar technologies requiring heterogeneous assembly. The term 'System Moore' refers to this new paradigm of ultra compact integration of electronic systems. It places packaging at the centre of the issues, no longer as a simple encapsulation function, but as a functional component. It implements dimensions ranging from the micron to the millimeter where a technological and economic gap exists. On the one hand, planar microelectronics technologies are expensive, oversized and unable to handle the thickness of materials. On the other hand, conventional methods of forming and machining materials reach their limits below the millimeter. In this context, laser micromachining completes the portfolio of microstructuring processes for microelectronics by occupying the '\u00b5m-mm' gap. This experimental study shows how laser ablation enables backside machining of radio frequency chips whose ultimate thickness membrane suspension reduces losses and nonlinear effects associated with the silicon carrier substrate. Implemented after the full completion of the monolithic CMOS circuit manufacturing flow, this laser process enters fully into a functional packaging logic.<\/p>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-13ewzjw-a235a21bea60534439757d9f11956514\">\n.av_font_icon.av-13ewzjw-a235a21bea60534439757d9f11956514{\ncolor:#800000;\nborder-color:#800000;\n}\n.av_font_icon.av-13ewzjw-a235a21bea60534439757d9f11956514 .av-icon-char{\nfont-size:20px;\nline-height:20px;\n}\n<\/style>\n<span  class='av_font_icon av-13ewzjw-a235a21bea60534439757d9f11956514 avia_animate_when_visible av-icon-style- avia-icon-pos-left avia-icon-animate'><span class='av-icon-char' aria-hidden='true' data-av_icon='\ue810' data-av_iconfont='entypo-fontello' ><\/span><\/span><strong><span style=\"color: #800000;\">Suspended membranes boost RF performance\u00a0<\/span><\/strong><br \/>\nThe literature reports new use cases of femtosecond silicon micromachining techniques for various applications such as microfluidics, photovoltaics, integrated circuit characterization, hydrophobic surface conditioning and laser cutting of microelectronic chips without wasting active surface. In this case, the application concerned the fabrication of suspended membranes of SOI-CMOS RF circuits\/functions on SOI (Silicon-on-Insulator) substrates. From an electrical point of view, despite the presence of an insulating layer (BOX), the carrier substrate degrades the electrical performance because it offers a parasitic coupling path to the RF signals. By locally removing the carrier substrate under the active area of the sensitive circuits, they can be suspended in the form of a membrane.<\/p>\n<\/div><\/section><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1af2d8r-daea022b54bb3361022e69a66d592346\">\n.flex_column.av-1af2d8r-daea022b54bb3361022e69a66d592346{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-1af2d8r-daea022b54bb3361022e69a66d592346 av_one_half  avia-builder-el-12  el_after_av_one_half  el_before_av_hr  flex_column_div av-zero-column-padding'     ><section  class='av_textblock_section av-kwx9jk40-0850d78397a6d22ebaff431210944bdf'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><p>At this point, the thickness of the active layer is ultimate, keeping only what is necessary to preserve the initial electronic function, namely, the active layers of the transistor and its interconnection network. The motivation for such a membrane process has been to obtain greatly improved RF performance by reducing dissipative losses, reducing substrate-induced nonlinearities and reducing parasitic capacitive coupling within the device or between devices (crosstalk). These three improvement factors have a major impact on the front-end of mobile communication systems for which more and more demanding specifications are required with the extension of frequency bands up to 6 GHz and in the millimeter range (24-48 GHz).<\/p>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-13ewzjw-a235a21bea60534439757d9f11956514\">\n.av_font_icon.av-13ewzjw-a235a21bea60534439757d9f11956514{\ncolor:#800000;\nborder-color:#800000;\n}\n.av_font_icon.av-13ewzjw-a235a21bea60534439757d9f11956514 .av-icon-char{\nfont-size:20px;\nline-height:20px;\n}\n<\/style>\n<span  class='av_font_icon av-13ewzjw-a235a21bea60534439757d9f11956514 avia_animate_when_visible av-icon-style- avia-icon-pos-left avia-icon-animate'><span class='av-icon-char' aria-hidden='true' data-av_icon='\ue810' data-av_iconfont='entypo-fontello' ><\/span><\/span>From a technological point of view, a preliminary step of optimization of the laser machining process has been implemented in order to obtain a precise control of the volume of material removed. This is the specific object of the article referenced in this commentary. The strategy consisted in systematically studying five parameters characterising the properties of a trench structured by a laser spot scan, namely, its depth, width, roughness as well as the volume rate of material removal and the volume of redeposited residues. From a fundamental point of view, the work allowed to highlight two ablation regimes, soft and strong, depending on the fluence (energy per unit area) of the laser beam (Fig.1). The laser firing rate is another parameter whose impact is preponderant. It has been shown that for the same fluence, a high firing frequency (f=200kHz) has a negative impact on the ablation efficiency and the machining quality compared to a low frequency (f=30kHz). The explanation for this phenomenon is that the material ejecta disturb the incident beam at high frequencies (Fig.2). The suspended membranes associated with different RF circuits are presented in Fig.3. The performance gains are summarized in Table 1 with reference to a high-resistivity silicon substrate. Among the first-order results, one can note an improved rejection of ~23 and ~8 dB of the 2nd and 3rd harmonic spurious signal level. A near doubling of the quality factor (Q) is observed for the single-wound inductors. The improvement in quality factor in these proportions is of primary interest for low noise amplifiers (LNAs) whose noise figure and linearity (IIP3), two figures of merit that are particularly difficult to improve, show a 0.1 dB and 0.5 dB improvement, respectively.<\/p>\n<\/div><\/section><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kwz296kn-cfbbde0e76ac4594d5630b57d5d45c9c\">\n#top .hr.hr-invisible.av-kwz296kn-cfbbde0e76ac4594d5630b57d5d45c9c{\nheight:15px;\n}\n<\/style>\n<div  class='hr av-kwz296kn-cfbbde0e76ac4594d5630b57d5d45c9c hr-invisible  avia-builder-el-15  el_after_av_one_half  el_before_av_one_full'><span class='hr-inner'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-o5ihij-8da6e693e5cec960f445cdf2c4d4ef67\">\n@keyframes av_boxShadowEffect_av-o5ihij-8da6e693e5cec960f445cdf2c4d4ef67-column {\n0%   { box-shadow:  0 0 0 0 #a0a0a0; opacity: 1; }\n100% { box-shadow:  0 0 10px 0 #a0a0a0; opacity: 1; }\n}\n.flex_column.av-o5ihij-8da6e693e5cec960f445cdf2c4d4ef67{\nbox-shadow: 0 0 10px 0 #a0a0a0;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-o5ihij-8da6e693e5cec960f445cdf2c4d4ef67 av_one_full  avia-builder-el-16  el_after_av_hr  el_before_av_one_full  first flex_column_div shadow-not-animated av-zero-column-padding'     ><section  class='av_textblock_section av-kwxa24y6-0661efd8caa987fa2673d4ab782ea0df'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel6.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-48819 size-full\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel6.jpg\" alt=\"\" width=\"700\" height=\"319\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel6.jpg 700w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel6-300x137.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel6-18x8.jpg 18w\" sizes=\"auto, (max-width: 700px) 100vw, 700px\" \/><br \/>\n<\/a><\/p>\n<p style=\"text-align: center;\"><em>Fig.1: Average depth of trenches machined by infrared laser scanning (1030nm) as a function of fluence for different scanning speeds and two firing rates (left) frep=30 kHz and (right) frep=200 kHz.  The dashed lines highlight the two ablation regimes as well as the threshold energy.<\/em><\/p>\n<\/div><\/section><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-o5ihij-8da6e693e5cec960f445cdf2c4d4ef67\">\n@keyframes av_boxShadowEffect_av-o5ihij-8da6e693e5cec960f445cdf2c4d4ef67-column {\n0%   { box-shadow:  0 0 0 0 #a0a0a0; opacity: 1; }\n100% { box-shadow:  0 0 10px 0 #a0a0a0; opacity: 1; }\n}\n.flex_column.av-o5ihij-8da6e693e5cec960f445cdf2c4d4ef67{\nbox-shadow: 0 0 10px 0 #a0a0a0;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-o5ihij-8da6e693e5cec960f445cdf2c4d4ef67 av_one_full  avia-builder-el-18  el_after_av_one_full  el_before_av_hr  first flex_column_div shadow-not-animated av-zero-column-padding  column-top-margin'     ><section  class='av_textblock_section av-kwxa24y6-0661efd8caa987fa2673d4ab782ea0df'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel7.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-48820 size-full\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel7.jpg\" alt=\"\" width=\"700\" height=\"323\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel7.jpg 700w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel7-300x138.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel7-18x8.jpg 18w\" sizes=\"auto, (max-width: 700px) 100vw, 700px\" \/><\/a><\/p>\n<p style=\"text-align: center;\"><em>Fig. 2: Width of trenches machined by infrared (1030nm) laser scanning as a function of fluence for different scanning speeds and two firing rates (left) frep=30 kHz and (right) frep=200 kHz. A high firing rate degrades the trench aperture at high fluence due to the interaction between the material ejecta and the incident beam.<\/em><\/p>\n<\/div><\/section><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kwz24ymg-bad7c576ee71159accfd108658e8c0f9\">\n#top .hr.hr-invisible.av-kwz24ymg-bad7c576ee71159accfd108658e8c0f9{\nheight:15px;\n}\n<\/style>\n<div  class='hr av-kwz24ymg-bad7c576ee71159accfd108658e8c0f9 hr-invisible  avia-builder-el-20  el_after_av_one_full  el_before_av_one_full'><span class='hr-inner'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-o5ihij-0475112fa834d680453de75806714378\">\n.flex_column.av-o5ihij-0475112fa834d680453de75806714378{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-o5ihij-0475112fa834d680453de75806714378 av_one_full  avia-builder-el-21  el_after_av_hr  el_before_av_hr  first flex_column_div av-zero-column-padding'     ><section  class='av_textblock_section av-kwxa24y6-0661efd8caa987fa2673d4ab782ea0df'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><p style=\"text-align: center;\"><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel5.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-48822 size-full\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel5.jpg\" alt=\"\" width=\"800\" height=\"251\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel5.jpg 800w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel5-300x94.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel5-768x241.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel5-18x6.jpg 18w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel5-705x221.jpg 705w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/a><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel7-1.jpg\"><br \/>\n<\/a><em>Fig. 3: Optical microscopy images of membranes suspended by machining on the backside of the silicon substrate. The images are obtained in transparency mode by backlighting the membranes (a) Insulation structure (b) Inductance (c) RF switch.<\/em><\/p>\n<\/div><\/section><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kwz26583-57f601c5cf5556e9eac4af8186d1bcab\">\n#top .hr.hr-invisible.av-kwz26583-57f601c5cf5556e9eac4af8186d1bcab{\nheight:1px;\n}\n<\/style>\n<div  class='hr av-kwz26583-57f601c5cf5556e9eac4af8186d1bcab hr-invisible  avia-builder-el-23  el_after_av_one_full  el_before_av_one_full'><span class='hr-inner'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-o5ihij-0475112fa834d680453de75806714378\">\n.flex_column.av-o5ihij-0475112fa834d680453de75806714378{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-o5ihij-0475112fa834d680453de75806714378 av_one_full  avia-builder-el-24  el_after_av_hr  el_before_av_textblock  first flex_column_div av-zero-column-padding'     ><section  class='av_textblock_section av-kwxa24y6-0661efd8caa987fa2673d4ab782ea0df'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><p style=\"text-align: center;\"><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel8.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-48825 size-full\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel8.jpg\" alt=\"\" width=\"951\" height=\"451\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel8.jpg 951w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel8-300x142.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel8-768x364.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel8-18x9.jpg 18w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2021\/12\/visuel8-705x334.jpg 705w\" sizes=\"auto, (max-width: 951px) 100vw, 951px\" \/><\/a><\/p>\n<\/div><\/section><\/div>\n<section  class='av_textblock_section av-kwxaltyd-870ae7394a5441247c146410777dc992'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><div  class='avia-button-wrap av-rpqvoq-94ab22d05756868102675b5baff3f7fd-wrap avia-button-left  avia-builder-el-27  avia-builder-el-no-sibling'><a href='mailto:emmanuel.dubois@iemn.fr'  class='avia-button av-rpqvoq-94ab22d05756868102675b5baff3f7fd av-link-btn avia-icon_select-yes-left-icon avia-size-small avia-position-left avia-color-silver'   aria-label=\"emmanuel.dubois@iemn.fr\"><span class='avia_button_icon avia_button_icon_left' aria-hidden='true' data-av_icon='\ue805' data-av_iconfont='entypo-fontello'><\/span><span class='avia_iconbox_title' >emmanuel.dubois@iemn.fr<\/span><\/a><\/div>\n<\/div><\/section>","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[297],"tags":[],"class_list":["post-48856","post","type-post","status-publish","format-standard","hentry","category-newsletter"],"_links":{"self":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts\/48856","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/comments?post=48856"}],"version-history":[{"count":0,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts\/48856\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/media?parent=48856"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/categories?post=48856"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/tags?post=48856"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}