{"id":41762,"date":"2020-06-25T15:49:16","date_gmt":"2020-06-25T13:49:16","guid":{"rendered":"https:\/\/www.iemn.fr\/?p=41762"},"modified":"2020-06-25T16:07:10","modified_gmt":"2020-06-25T14:07:10","slug":"these-jean-marc-boucaud-evaluation-dun-interposer-electro-optique-sur-substrat-de-verre-pour-interconnexions-optiques-400-gb-s-a-base-de-technologie-photonique-sur-silicium","status":"publish","type":"post","link":"https:\/\/www.iemn.fr\/en\/articles-temporaires\/these-jean-marc-boucaud-evaluation-dun-interposer-electro-optique-sur-substrat-de-verre-pour-interconnexions-optiques-400-gb-s-a-base-de-technologie-photonique-sur-silicium.html","title":{"rendered":"THESE : Jean-Marc BOUCAUD \u2013 Evaluation d\u2019un interposer e\u0301lectro-optique sur substrat de verre pour interconnexions optiques 400 Gb\/s a\u0300 base de technologie photonique sur silicium"},"content":{"rendered":"<div id='layer_slider_1'  class='avia-layerslider main_color avia-shadow  avia-builder-el-0  el_before_av_heading  avia-builder-el-first  container_wrap sidebar_right'  style='height: 261px;'  ><div id=\"layerslider_58_182wxglj9c8y8\" data-ls-slug=\"homepageslider\" class=\"ls-wp-container fitvidsignore ls-selectable\" style=\"width:1140px;height:260px;margin:0 auto;margin-bottom: 0px;\"><div class=\"ls-slide\" data-ls=\"duration:6000;transition2d:5;\"><img loading=\"lazy\" decoding=\"async\" width=\"2600\" height=\"270\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1.jpg\" class=\"ls-bg\" alt=\"\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1.jpg 2600w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-300x31.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-768x80.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-1030x107.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-1500x156.jpg 1500w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-705x73.jpg 705w\" sizes=\"auto, (max-width: 2600px) 100vw, 2600px\" \/><ls-layer style=\"font-size:14px;text-align:left;font-style:normal;text-decoration:none;text-transform:none;font-weight:700;letter-spacing:0px;border-style:solid;border-color:#000;background-position:0% 0%;background-repeat:no-repeat;width:180px;height:30px;left:0px;top:231px;line-height:32px;color:#ffffff;border-radius:6px 6px 6px 6px;padding-left:50px;background-color:rgba(0, 0, 0, 0.57);\" class=\"ls-l ls-ib-icon ls-text-layer\" data-ls=\"minfontsize:0;minmobilefontsize:0;\"><i class=\"fa fa-quote-right\" style=\"color:#ffffff;margin-right:0.8em;font-size:1em;transform:translateY( -0.125em );\"><\/i>ACTUALITES<\/ls-layer><\/div><\/div><\/div><div id='after_layer_slider_1'  class='main_color av_default_container_wrap container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-41762'><div class='entry-content-wrapper clearfix'>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_heading-308d3ee721c6d133ae13a60621e70912\">\n#top .av-special-heading.av-av_heading-308d3ee721c6d133ae13a60621e70912{\nmargin:0 0 10px 0;\npadding-bottom:4px;\n}\nbody .av-special-heading.av-av_heading-308d3ee721c6d133ae13a60621e70912 .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-av_heading-308d3ee721c6d133ae13a60621e70912 .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-av_heading-308d3ee721c6d133ae13a60621e70912 av-special-heading-h2  avia-builder-el-1  el_after_av_layerslider  el_before_av_hr  avia-builder-el-first'><h2 class='av-special-heading-tag'  itemprop=\"headline\"  >THESE : Jean-Marc BOUCAUD \u2013 Evaluation d\u2019un interposer e\u0301lectro-optique sur substrat de verre pour interconnexions optiques 400 Gb\/s a\u0300 base de technologie photonique sur silicium<\/h2><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-18u73nj-dad6a947580930e400fc42ba200e80f1\">\n#top .hr.av-18u73nj-dad6a947580930e400fc42ba200e80f1{\nmargin-top:5px;\nmargin-bottom:5px;\n}\n.hr.av-18u73nj-dad6a947580930e400fc42ba200e80f1 .hr-inner{\nwidth:100%;\n}\n<\/style>\n<div  class='hr av-18u73nj-dad6a947580930e400fc42ba200e80f1 hr-custom  avia-builder-el-2  el_after_av_heading  el_before_av_textblock  hr-left hr-icon-no'><span class='hr-inner inner-border-av-border-thin'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n<section  class='av_textblock_section av-jriy64i8-2f4600354c0449b610997916bbd9b6bc'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" >\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-13ewzjw-68e036126b913e5028f77311dc66b825\">\n.av_font_icon.av-13ewzjw-68e036126b913e5028f77311dc66b825{\ncolor:#bfbfbf;\nborder-color:#bfbfbf;\n}\n.av_font_icon.av-13ewzjw-68e036126b913e5028f77311dc66b825 .av-icon-char{\nfont-size:60px;\nline-height:60px;\n}\n<\/style>\n<span  class='av_font_icon av-13ewzjw-68e036126b913e5028f77311dc66b825 avia_animate_when_visible av-icon-style- avia-icon-pos-left avia-icon-animate'><span class='av-icon-char' aria-hidden='true' data-av_icon='\ue8c9' data-av_iconfont='entypo-fontello' ><\/span><\/span>\n<p><strong>Jean-Marc BOUCAUD\u00a0<\/strong><\/p>\n<p>Soutenance : 26 juin 2020 \u00e0 10h30<strong><br \/>\n<\/strong>Salle Belledonne \u2013 Minatec \u2013 IMEP-LAHC \u2013 Grenoble<\/p>\n<\/div><\/section>\n<section  class='av_textblock_section av-jtefqx33-628129dba2299b2ecd65ebfc92eac29d'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><div  class='hr av-kjh3zw-4dff888f744b728a1aca9b3a0971493a hr-default  avia-builder-el-6  avia-builder-el-no-sibling'><span class='hr-inner'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n<h5><strong><span style=\"color: #800000;\">Jury :<\/span><\/strong><\/h5>\n<ul>\n<li>Emmanuel DUBOIS, DR1, CNRS, Directeur de th\u00e8se<\/li>\n<li>Delphine MARRIS-MORINI, Professeur des Universit\u00e9s, Universit\u00e9 Paris Saclay \/ C2N, Rapporteur<\/li>\n<li>Taha BENYATTOU, Directeur de Recherche, INSA Lyon \/ INL-CNRS, Rapporteur<\/li>\n<li>Jean-Emmanuel BROQUIN, Professeur des Universit\u00e9s, Institut National Polytechnique de Grenoble (INPG), CoDirecteur de th\u00e8se<\/li>\n<li>Sylvie MENEZO, CEO, SCINTIL Photonics, Examinateur<\/li>\n<li>Moritz SEYFRIED, R&amp;D Manager, ficonTEC, Examinateur<\/li>\n<li>Peter O\u2019BRIEN, Head of Photonics Packaging \u2013 Adjunct Professor, Tyndall National Institute, Examinateur<\/li>\n<li>C\u00e9dric DURAND, Ing\u00e9nieur, STMicroelectronics, Examinateur<\/li>\n<\/ul>\n<h5>Summary:<\/h5>\n<p>Le trafic de donn\u00e9es interne aux datacenters a connu une croissance exponentielle ces derni\u00e8res ann\u00e9es avec une mise sous pression permanente de la capacit\u00e9 de stockage, du d\u00e9bit et du temps de latence. Une cons\u00e9quence directe de cette course a\u0300 la performance est l\u2019am\u00e9lioration inexorable des technologies d\u2019interconnexion pour r\u00e9pondre a\u0300 cette demande. Dans la recherche de communications \u00e0 fibre optique a\u0300 faible co\u00fbt pour les datacenters, la photonique sur silicium, une technologie \u00e9lectro-optique d\u00e9riv\u00e9e des technologies CMOS standard, appara\u00eet comme une solution prometteuse pour r\u00e9duire la consommation d\u2019\u00e9nergie, am\u00e9liorer les d\u00e9bits de donn\u00e9es des liaisons optiques tout en restant e\u0301conomiquement rentable. Bien que les proc\u00e9d\u00e9s technologiques associ\u00e9s aux plateformes CMOS puissent \u00eatre judicieusement exploit\u00e9s pour l\u2019int\u00e9gration monolithique de fonctions optiques extr\u00eamement denses et performantes, la photonique sur silicium pr\u00e9sente n\u00e9anmoins des contraintes de packaging suppl\u00e9mentaires li\u00e9es a\u0300 l\u2019interfac\u0327age avec les fibres optiques d\u2019entr\u00e9e\/sortie. Ces contraintes d\u2019assemblage entrainent un accroissement substantiel du co\u00fbt des \u00e9metteurs-r\u00e9cepteurs optiques a\u0300 base de puces photoniques silicium et compliquent la mise en \u0153uvre de technologies telles que le multiplexage en longueur d\u2019onde \u00e0 bas co\u00fbt (CWDM).<\/p>\n<p>L\u2019objectif premier de cette th\u00e8se est d\u2019\u00e9tudier et d\u00e9velopper une version bas co\u00fbt d\u2019interposeur embarquant des fonctions \u00e9lectriques et optiques int\u00e9gr\u00e9s \u00e0 un substrat de verre. L\u2019ambition consiste a\u0300 r\u00e9aliser l\u2019assemblage passif complet d\u2019un \u00e9metteur-r\u00e9cepteur CWDM bas\u00e9 sur la technologie photonique sur silicium PIC25G de STMicroelectronics.<br \/>\nEn premier lieu, ce travail propose la conception des principales fonctions \u00e9l\u00e9mentaires int\u00e9gr\u00e9e \u00e0 l\u2019interposeur, \u00e0 savoir, des guides d\u2019ondes monomodes, des structures de couplage vertical et des lignes de transmission hautes fr\u00e9quences. Dans un second temps, un proc\u00e9d\u00e9 de fabrication, principalement bas\u00e9 sur l\u2019ablation laser femtoseconde, a \u00e9t\u00e9 d\u00e9velopp\u00e9 afin d\u2019int\u00e9grer ces fonctions sur un substrat de verre sur lequel une puce PIC25G peut \u00eatre interfac\u00e9es. Enfin, la fonctionnalit\u00e9 de l\u2019interposeur et de l\u2019assemblage complet a \u00e9t\u00e9 d\u00e9montr\u00e9e au travers d\u2019un travail d\u00e9taill\u00e9 de caract\u00e9risations \u00e9lectriques, optiques et mixtes.<\/p>\n<p>Nous avons fabriqu\u00e9 un interposeur int\u00e9grant des guides d\u2019ondes multimodes avec des pertes de propagation &lt;6 dB \/ cm a\u0300 1310 nm, des lignes de transmission coplanaires avec des pertes d\u2019insertion de 3 dB \/ cm a\u0300 60 GHz, des miroirs de redirection du signal optique et l\u2019ensemble du routage \u00e9lectrique et optique permettant de tester la d\u00e9tection et la modulation de la lumi\u00e8re par la puce PIC25G. Nous avons r\u00e9alis\u00e9 l\u2019assemblage de la puce PIC25G sur l\u2019interposeur en utilisant une technique classique de flip-chip et avons valid\u00e9 le couplage optique entre les guides d\u2019ondes en polym\u00e8re de l\u2019interposeur et les guides d\u2019ondes sur substrat silicium-sur-isolant (SOI) de la puce PIC25G gr\u00e2ce \u00e0 la mesure du photo-courant d\u2019une photodiode SiGe int\u00e9gr\u00e9e dans la puce photonique.<\/p>\n<h5>Abstract:<\/h5>\n<p>Data traffic inside data centers has grown exponentially in recent years, with a constant pressure storage capacity, data rate and latency. A direct consequence of this race for performance is the persistent improvement in interconnect technologies to meet this demand. In the search for higher data rate and lower cost optical fiber communications for data centers, silicon photonics, an electro-optical technology derived from standard CMOS technologies, appears as a promising solution to reduce power consumption and enhance data rates of optical links while remaining economically viable. Despite leveraging most of the developments around the CMOS platform, Silicon photonics presents additional packaging constraints related to the interfacing of input\/output optical fiber. These packaging constraints induce a substantial increase of silicon photonics bases optical transceivers cost and complicates the implementation of technologies such as coarse wavelength division multiplexing (CWDM).<\/p>\n<p>The purpose of this thesis is to study and develop a low-cost interposer made on a glass substrate implementing both electrical and optical functions with the ambition to perform a complete passive assembly of a CWDM transceiver based on STMicroelectronics PIC25G silicon photonic technology.<br \/>\nFirstly, this work proposes to design the interposer main components, namely, single mode waveguides, vertical coupling structures and high frequency transmission lines. Then, a fabrication process mainly relying on femtosecond laser ablation that allow to implement these components on a glass substrate as well as the assembly with an existing PIC25G chip is developed. Finally, the interposer and the complete assembly functions are demonstrated through detailed electrical, optical and hybrid characterizations.<\/p>\n<p>We fabricated an interposer implementing multimode waveguides with propagation losses &lt; 6dB\/cm at 1310 nm, coplanar transmission lines with insertion losses of 3 dB\/cm at 60 GHz, slanted TIR mirrors and all the electrical and optical routing allowing to test the detection and modulation of light by the PIC25G chip. We achieved the assembly of the PIC25G chip over the interposer using the conventional flip-chip technique and demonstrated an optical coupling between the polymer waveguide interposer and the silicon-on-insulator waveguide of the PIC25G chip through the measurement of the photo-current of an SiGe photodiode embedded in the silicon photonic chip.<\/p>\n<\/div><\/section>","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[36],"tags":[],"class_list":["post-41762","post","type-post","status-publish","format-standard","hentry","category-articles-temporaires"],"_links":{"self":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts\/41762","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/comments?post=41762"}],"version-history":[{"count":0,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts\/41762\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/media?parent=41762"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/categories?post=41762"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/tags?post=41762"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}