{"id":37466,"date":"2019-07-18T08:37:17","date_gmt":"2019-07-18T06:37:17","guid":{"rendered":"https:\/\/www.iemn.fr\/?p=37466"},"modified":"2019-07-18T08:37:19","modified_gmt":"2019-07-18T06:37:19","slug":"micro-structuration-laser-pour-le-packaging-electro-optique-avance","status":"publish","type":"post","link":"https:\/\/www.iemn.fr\/en\/these\/micro-structuration-laser-pour-le-packaging-electro-optique-avance.html","title":{"rendered":"Micro-structuration laser pour le packaging \u00e9lectro-optique avanc\u00e9"},"content":{"rendered":"<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_one_full-25347b0a799d5b9f7058434b2a9c3182\">\n.flex_column.av-av_one_full-25347b0a799d5b9f7058434b2a9c3182{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-av_one_full-25347b0a799d5b9f7058434b2a9c3182 av_one_full  avia-builder-el-0  avia-builder-el-no-sibling  first flex_column_div av-zero-column-padding'     ><section  class='av_textblock_section av-jy8assh7-2c64a3e9c814b696ace6e2d297550d14'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><blockquote>\n<h4><strong><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/03\/ico_these2.fw_.png\"><img loading=\"lazy\" decoding=\"async\" class=\"size-thumbnail wp-image-14684 alignleft\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/03\/ico_these2.fw_-80x80.png\" alt=\"\" width=\"80\" height=\"80\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/03\/ico_these2.fw_-80x80.png 80w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/03\/ico_these2.fw_-36x36.png 36w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/03\/ico_these2.fw_-180x180.png 180w\" sizes=\"auto, (max-width: 80px) 100vw, 80px\" \/><\/a>Quentin HIVIN<br \/>\n<\/strong><\/h4>\n<p>Thesis defence<br \/>\n25\/06\/2019<br \/>\nIEMN Amphitheatre<\/p>\n<\/blockquote>\n<h4><strong><br \/>\nSummary:<\/strong><\/h4>\n<p>Le d\u00e9veloppement de l\u2019internet des objets et des services de vid\u00e9o en temps r\u00e9el (streaming) a conduit \u00e0 une augmentation continue du trafic des donn\u00e9es au sein des data-centers. Celui-ci devrait \u00eatre multipli\u00e9 par trois entre 2012 et 2020 pour atteindre 15.3 zettaoctets\/an. Cette \u00e9volution appelle parall\u00e8lement \u00e0 un accroissement des performances des composants t\u00e9l\u00e9com en transmission optique monomode dont le standard s\u2019\u00e9tablit aujourd\u2019hui \u00e0 100-200 Gbits\/s pour \u00e9voluer vers 400-800 Gbits\/s dans un futur proche. Bien que les c\u0153urs de technologies semiconducteurs soient aujourd\u2019hui disponibles pour r\u00e9pondre \u00e0 cette demande, les co\u00fbts \u00e9lev\u00e9s d\u2019assemblage des puces \u00e9lectroniques (EIC) et photoniques (PIC) ainsi que l\u2019alignement avec les fibres optiques monomodes limitent la p\u00e9n\u00e9tration de cette solution technologique sur le march\u00e9. Afin de relever ce d\u00e9fi, une structure originale d\u2019interposeur en verre a \u00e9t\u00e9 propos\u00e9e dans le cadre du laboratoire commun IEMN-STMicroelectronics. Ce substrat d\u2019assemblage en verre pr\u00e9sente des avantages distinctifs majeurs tels que i) l\u2019alignement passif de la fibre externe, ii) l\u2019alignement optique passif du PIC sur l\u2019interposeur, iii) le transfert des fonctions optiques passives du PIC sur l\u2019interposeur de verre et iv) une approche conservative r\u00e9utilisant les coupleurs \u00e0 r\u00e9seau du PIC.<br \/>\nLe contexte du packaging \u00e9lectro-optique \u00e9tant pos\u00e9, ce travail de th\u00e8se s\u2019est concentr\u00e9 sur la fonctionnalisation de substrats de verre par photo-inscription ou micro-usinage laser en r\u00e9gime femtoseconde afin de structurer les guides d\u2019onde optique, les miroirs de redirection du faisceau guid\u00e9 et la couche de redistribution \u00e9lectrique en cuivre. En premier lieu, des guides optiques monomodes \u00e0 1310 nm de bonne qualit\u00e9 ont \u00e9t\u00e9 obtenus et caract\u00e9ris\u00e9s, permettant une mise en \u00e9vidence franche des effets d\u2019absorption non lin\u00e9aire, d\u2019auto-focalisation et de filamentation. Une \u00e9tude exp\u00e9rimentale compl\u00e8te a permis de d\u00e9terminer les param\u00e8tres d\u2019exposition laser et de gravure chimique pour la fabrication de miroirs photoniques. Enfin, une m\u00e9thode originale de structuration des interconnexions bas\u00e9e sur le fractionnement et le d\u00e9collement de la couche de cuivre par effet thermo-m\u00e9canique a \u00e9t\u00e9 d\u00e9velopp\u00e9e.<\/p>\n<h4><strong>Abstract:<\/strong><\/h4>\n<p>The development of the Internet of Things and video streaming services is leadng to a continuous increase in data traffic within data-centers that is expected to increase threefold between 2012 and 2020 reaching 15.3 zettabytes\/year. This evolution calls for an increase in performance of telecom components in optical single mode transmission, the standard of which is now 100-200 Gbits\/s and will evolve towards 400-800 Gbits\/s in the near future. Although the semiconductor technology cores are now available to meet this demand, the high assembly costs of electronic (EIC) and photonic (PIC) integrated circuits as well as the alignment with single-mode optical fibers limit the market penetration of this technological solution. In order to meet the challenge, an original glass interposer structure has been proposed in the framework of the IEMN-STMicroelectronics common laboratory. This glass assembly substrate holds major distinctive advantages such as i) passive alignment of the external fiber, ii) passive optical alignment of the PIC on the interposer, iii) transfer of the passive optical functions of the PIC onto the glass interposer and iv) a conservative approach reusing the PIC grating couplers.<br \/>\nWith this context associated to electro-optical packaging in mind, this thesis has focused on the functionalization of glass substrates by photo-inscription or laser micromachining in femtosecond regime in order to structure optical waveguides, redirection mirrors and copper electrical redistribution layer. First, good quality 1310 nm single-mode optical guides were obtained and characterized, allowing a clear demonstration of the effects of non-linear absorption, self-focusing and filamentation. A complete experimental study determined the laser exposure and chemical etching parameters for the manufacture of photonic mirrors. Finally, an original method for structuring interconnections based on the fractionation and detachment of the copper layer by thermo-mechanical effect has been developed.<\/p>\n<h4><strong>JURY :<\/strong><\/h4>\n<p>&#8211; Emmanuel DUBOIS, Directeur de th\u00e8se<\/p>\n<p>&#8211; Christophe GAQUIERE, Universit\u00e9 de Lille, CoDirecteur de th\u00e8se<\/p>\n<p>&#8211; Luca VARANI, Universit\u00e9 de Montpellier, Rapporteur<\/p>\n<p>&#8211; Philippe DELAPORTE, Universit\u00e9 de Lille, Rapporteur<\/p>\n<p>&#8211; Sophie COSTIL, CEZAMAT, Universit\u00e9 de Technologie de Belfort-Montb\u00e9liard, Examinateur<\/p>\n<p>&#8211; Jean-Emmanuel BROQUIN, Universit\u00e9 de Grenoble, Examinateur<\/p>\n<\/div><\/section><\/div>","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[199],"tags":[],"class_list":["post-37466","post","type-post","status-publish","format-standard","hentry","category-these"],"_links":{"self":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts\/37466","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/comments?post=37466"}],"version-history":[{"count":0,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts\/37466\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/media?parent=37466"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/categories?post=37466"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/tags?post=37466"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}