{"id":37158,"date":"2019-06-18T13:55:46","date_gmt":"2019-06-18T11:55:46","guid":{"rendered":"https:\/\/www.iemn.fr\/?p=37158"},"modified":"2019-06-27T09:29:43","modified_gmt":"2019-06-27T07:29:43","slug":"soutenance-de-these-quentin-hivin-micro-structuration-laser-pour-le-packaging-electro-optique-avance","status":"publish","type":"post","link":"https:\/\/www.iemn.fr\/en\/actualites\/soutenance-de-these-quentin-hivin-micro-structuration-laser-pour-le-packaging-electro-optique-avance.html","title":{"rendered":"Soutenance de th\u00e8se : Quentin HIVIN\u00a0\u2013 Micro-structuration laser pour le packaging \u00e9lectro-optique avanc\u00e9"},"content":{"rendered":"<div id='layer_slider_1'  class='avia-layerslider main_color avia-shadow  avia-builder-el-0  el_before_av_heading  avia-builder-el-first  container_wrap sidebar_right'  style='height: 261px;'  ><div id=\"layerslider_58_ndrxydmwm6et\" data-ls-slug=\"homepageslider\" class=\"ls-wp-container fitvidsignore ls-selectable\" style=\"width:1140px;height:260px;margin:0 auto;margin-bottom: 0px;\"><div class=\"ls-slide\" data-ls=\"duration:6000;transition2d:5;\"><img loading=\"lazy\" decoding=\"async\" width=\"2600\" height=\"270\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1.jpg\" class=\"ls-bg\" alt=\"\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1.jpg 2600w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-300x31.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-768x80.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-1030x107.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-1500x156.jpg 1500w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2019\/01\/sliders_news1-705x73.jpg 705w\" sizes=\"auto, (max-width: 2600px) 100vw, 2600px\" \/><ls-layer style=\"font-size:14px;text-align:left;font-style:normal;text-decoration:none;text-transform:none;font-weight:700;letter-spacing:0px;border-style:solid;border-color:#000;background-position:0% 0%;background-repeat:no-repeat;width:180px;height:30px;left:0px;top:231px;line-height:32px;color:#ffffff;border-radius:6px 6px 6px 6px;padding-left:50px;background-color:rgba(0, 0, 0, 0.57);\" class=\"ls-l ls-ib-icon ls-text-layer\" data-ls=\"minfontsize:0;minmobilefontsize:0;\"><i class=\"fa fa-quote-right\" style=\"color:#ffffff;margin-right:0.8em;font-size:1em;transform:translateY( -0.125em );\"><\/i>ACTUALITES<\/ls-layer><\/div><\/div><\/div><div id='after_layer_slider_1'  class='main_color av_default_container_wrap container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-37158'><div class='entry-content-wrapper clearfix'>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-wzm51i-44eab3ba264029407dafd13d016f87c2\">\n#top .av-special-heading.av-wzm51i-44eab3ba264029407dafd13d016f87c2{\nmargin:0 0 10px 0;\npadding-bottom:4px;\n}\nbody .av-special-heading.av-wzm51i-44eab3ba264029407dafd13d016f87c2 .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-wzm51i-44eab3ba264029407dafd13d016f87c2 .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-wzm51i-44eab3ba264029407dafd13d016f87c2 av-special-heading-h2  avia-builder-el-1  el_after_av_layerslider  el_before_av_hr  avia-builder-el-first'><h2 class='av-special-heading-tag'  itemprop=\"headline\"  >THESE : Micro-structuration laser pour le packaging \u00e9lectro-optique avanc\u00e9<\/h2><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-18u73nj-dad6a947580930e400fc42ba200e80f1\">\n#top .hr.av-18u73nj-dad6a947580930e400fc42ba200e80f1{\nmargin-top:5px;\nmargin-bottom:5px;\n}\n.hr.av-18u73nj-dad6a947580930e400fc42ba200e80f1 .hr-inner{\nwidth:100%;\n}\n<\/style>\n<div  class='hr av-18u73nj-dad6a947580930e400fc42ba200e80f1 hr-custom  avia-builder-el-2  el_after_av_heading  el_before_av_textblock  hr-left hr-icon-no'><span class='hr-inner inner-border-av-border-thin'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n<section  class='av_textblock_section av-jriy64i8-2f4600354c0449b610997916bbd9b6bc'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" >\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-13ewzjw-68e036126b913e5028f77311dc66b825\">\n.av_font_icon.av-13ewzjw-68e036126b913e5028f77311dc66b825{\ncolor:#bfbfbf;\nborder-color:#bfbfbf;\n}\n.av_font_icon.av-13ewzjw-68e036126b913e5028f77311dc66b825 .av-icon-char{\nfont-size:60px;\nline-height:60px;\n}\n<\/style>\n<span  class='av_font_icon av-13ewzjw-68e036126b913e5028f77311dc66b825 avia_animate_when_visible av-icon-style- avia-icon-pos-left avia-icon-animate'><span class='av-icon-char' aria-hidden='true' data-av_icon='\ue8c9' data-av_iconfont='entypo-fontello' ><\/span><\/span>\n<h5><strong style=\"font-size: 16px;\">Quentin HIVIN\u00a0<\/strong><\/h5>\n<p><strong>Mardi 25 juin 2019 \u2013 10h30<br \/>\n<\/strong>Amphitheatre of the IEMN-Laboratoire central - Villeneuve d'Ascq<\/p>\n<\/div><\/section>\n<section  class='av_textblock_section av-jtefqx33-628129dba2299b2ecd65ebfc92eac29d'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock'  itemprop=\"text\" ><div  class='hr av-kjh3zw-4dff888f744b728a1aca9b3a0971493a hr-default  avia-builder-el-6  avia-builder-el-no-sibling'><span class='hr-inner'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n<h5><span style=\"color: #333333;\"><strong>Jury:<\/strong><\/span><\/h5>\n<ul>\n<li>Luca VARANI, Professeur des Universit\u00e9s, Universit\u00e9 de Montpellier (Rapporteur)<\/li>\n<li>Philippe\u00a0DELAPORTE, Directeur de Recherche, Universit\u00e9 d\u2019Aix-Marseille\u00a0 (Rapporteur)<\/li>\n<li>Emmanuel\u00a0DUBOIS, Directeur de Recherche, Universit\u00e9 de Lille (Directeur de th\u00e8se)<\/li>\n<li>Christophe GAQUIERE, Professeur des Universit\u00e9s, Universit\u00e9 de Lille (Codirecteur de th\u00e8se)<\/li>\n<li>Sophie COSTIL, Professeur des Universit\u00e9s, Universit\u00e9 de Technologie de Belfort-Montb\u00e9liard (Examinatrice)<\/li>\n<li>Jean-Emmanuel BROQUIN,\u00a0 Professeur des Universit\u00e9s,\u00a0 Universit\u00e9 de Grenoble (Examinateur)<\/li>\n<\/ul>\n<h5><strong>Summary:<\/strong><\/h5>\n<p>Le d\u00e9veloppement de l\u2019internet des objets et des services de vid\u00e9o en temps r\u00e9el (streaming) a conduit \u00e0 une augmentation continue du trafic des donn\u00e9es au sein des data-centers. Celui-ci devrait \u00eatre multipli\u00e9 par trois entre 2012 et 2020 pour atteindre 15.3 zettaoctets\/an. Cette \u00e9volution appelle parall\u00e8lement \u00e0 un accroissement des performances des composants t\u00e9l\u00e9com en transmission optique monomode dont le standard s\u2019\u00e9tablit aujourd\u2019hui \u00e0 100-200 Gbits\/s pour \u00e9voluer vers 400-800 Gbits\/s dans un futur proche. Bien que les c\u0153urs de technologies semiconducteurs soient aujourd\u2019hui disponibles pour r\u00e9pondre \u00e0 cette demande, les co\u00fbts \u00e9lev\u00e9s d\u2019assemblage des puces \u00e9lectroniques (EIC) et photoniques (PIC) ainsi que l\u2019alignement avec les fibres optiques monomodes limitent la p\u00e9n\u00e9tration de cette solution technologique sur le march\u00e9. Afin de relever ce d\u00e9fi, une structure originale d\u2019interposeur en verre a \u00e9t\u00e9 propos\u00e9e dans le cadre du laboratoire commun IEMN-STMicroelectronics. Ce substrat d\u2019assemblage en verre pr\u00e9sente des avantages distinctifs majeurs tels que i) l\u2019alignement passif de la fibre externe, ii) l\u2019alignement optique passif du PIC sur l\u2019interposeur, iii) le transfert des fonctions optiques passives du PIC sur l\u2019interposeur de verre et iv) une approche conservative r\u00e9utilisant les coupleurs \u00e0 r\u00e9seau du PIC.<br \/>\nLe contexte du packaging \u00e9lectro-optique \u00e9tant pos\u00e9, ce travail de th\u00e8se s\u2019est concentr\u00e9 sur la fonctionnalisation de substrats de verre par photo-inscription ou micro-usinage laser en r\u00e9gime femtoseconde afin de structurer les guides d\u2019onde optique, les miroirs de redirection du faisceau guid\u00e9 et la couche de redistribution \u00e9lectrique en cuivre. En premier lieu, des guides optiques monomodes \u00e0 1310 nm de bonne qualit\u00e9 ont \u00e9t\u00e9 obtenus et caract\u00e9ris\u00e9s, permettant une mise en \u00e9vidence franche des effets d\u2019absorption non lin\u00e9aire, d\u2019auto-focalisation et de filamentation. Une \u00e9tude exp\u00e9rimentale compl\u00e8te a permis de d\u00e9terminer les param\u00e8tres d\u2019exposition laser et de gravure chimique pour la fabrication de miroirs photoniques. Enfin, une m\u00e9thode originale de structuration des interconnexions bas\u00e9e sur le fractionnement et le d\u00e9collement de la couche de cuivre par effet thermo-m\u00e9canique a \u00e9t\u00e9 d\u00e9velopp\u00e9e.<\/p>\n<h5><strong>Abstract:<\/strong><\/h5>\n<p>The development of the Internet of Things and video streaming services is leadng to a continuous increase in data traffic within data-centers that is expected to increase threefold between 2012 and 2020 reaching 15.3 zettabytes\/year. This evolution calls for an increase in performance of telecom components in optical single mode transmission, the standard of which is now 100-200 Gbits\/s and will evolve towards 400-800 Gbits\/s in the near future. Although the semiconductor technology cores are now available to meet this demand, the high assembly costs of electronic (EIC) and photonic (PIC) integrated circuits as well as the alignment with single-mode optical fibers limit the market penetration of this technological solution. In order to meet the challenge, an original glass interposer structure has been proposed in the framework of the IEMN-STMicroelectronics common laboratory. This glass assembly substrate holds major distinctive advantages such as i) passive alignment of the external fiber, ii) passive optical alignment of the PIC on the interposer, iii) transfer of the passive optical functions of the PIC onto the glass interposer and iv) a conservative approach reusing the PIC grating couplers.<br \/>\nWith this context associated to electro-optical packaging in mind, this thesis has focused on the functionalization of glass substrates by photo-inscription or laser micromachining in femtosecond regime in order to structure optical waveguides, redirection mirrors and copper electrical redistribution layer. First, good quality 1310 nm single-mode optical guides were obtained and characterized, allowing a clear demonstration of the effects of non-linear absorption, self-focusing and filamentation. A complete experimental study determined the laser exposure and chemical etching parameters for the manufacture of photonic mirrors. Finally, an original method for structuring interconnections based on the fractionation and detachment of the copper layer by thermo-mechanical effect has been developed.<\/p>\n<\/div><\/section>","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":37063,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[],"class_list":["post-37158","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites"],"_links":{"self":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts\/37158","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/comments?post=37158"}],"version-history":[{"count":0,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/posts\/37158\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/media\/37063"}],"wp:attachment":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/media?parent=37158"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/categories?post=37158"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/tags?post=37158"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}