{"id":16680,"date":"2018-04-25T14:05:52","date_gmt":"2018-04-25T12:05:52","guid":{"rendered":"https:\/\/www.iemn.fr?page_id=16680"},"modified":"2024-09-05T12:27:22","modified_gmt":"2024-09-05T10:27:22","slug":"microelecsi","status":"publish","type":"page","link":"https:\/\/www.iemn.fr\/en\/la-recherche\/les-groupes\/microelecsi","title":{"rendered":"Group : MICROELEC SI"},"content":{"rendered":"<div id='layer_slider_1'  class='avia-layerslider main_color avia-shadow  avia-builder-el-0  el_before_av_submenu  avia-builder-el-first  container_wrap sidebar_right'  style='height: 261px;'  ><div id=\"layerslider_21_df06s4yp1emu\" data-ls-slug=\"homepageslider\" class=\"ls-wp-container fitvidsignore ls-selectable\" style=\"width:1140px;height:260px;margin:0 auto;margin-bottom: 0px;\"><div class=\"ls-slide\" data-ls=\"duration:6000;transition2d:5;\"><img loading=\"lazy\" decoding=\"async\" width=\"2600\" height=\"270\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_leaf.jpg\" class=\"ls-bg\" alt=\"\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_leaf.jpg 2600w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_leaf-300x31.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_leaf-768x80.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_leaf-1030x107.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_leaf-1500x156.jpg 1500w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_leaf-705x73.jpg 705w\" sizes=\"auto, (max-width: 2600px) 100vw, 2600px\" \/><ls-layer style=\"font-size:14px;text-align:left;font-style:normal;text-decoration:none;text-transform:none;font-weight:700;letter-spacing:0px;background-position:0% 0%;background-repeat:no-repeat;mix-blend-mode:normal;top:231px;left:0px;height:30px;width:360px;line-height:32px;color:#ffffff;border-radius:6px 6px 6px 6px;padding-left:50px;background-color:rgba(0, 0, 0, 0.57);\" class=\"ls-l ls-ib-icon ls-text-layer\" data-ls=\"minfontsize:0;minmobilefontsize:0;\"><i class=\"fa fa-user-circle\" style=\"color:#f2f2f2;margin-right:0.8em;font-size:1em;transform:translateY( -0.125em );\"><\/i>GROUPE DE RECHERCHE : MICROELEC SI<\/ls-layer><\/div><div class=\"ls-slide\" data-ls=\"duration:4000;transition2d:5;\"><img loading=\"lazy\" decoding=\"async\" width=\"2600\" height=\"270\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_lille.jpg\" class=\"ls-bg\" alt=\"\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_lille.jpg 2600w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_lille-300x31.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_lille-768x80.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_lille-1030x107.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_lille-1500x156.jpg 1500w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_lille-705x73.jpg 705w\" sizes=\"auto, (max-width: 2600px) 100vw, 2600px\" \/><ls-layer style=\"font-size:14px;text-align:left;font-style:normal;text-decoration:none;text-transform:none;font-weight:700;letter-spacing:0px;background-position:0% 0%;background-repeat:no-repeat;mix-blend-mode:normal;top:231px;left:0px;height:30px;width:360px;line-height:32px;color:#ffffff;border-radius:6px 6px 6px 6px;padding-left:50px;background-color:rgba(0, 0, 0, 0.57);\" class=\"ls-l ls-ib-icon ls-text-layer\" data-ls=\"minfontsize:0;minmobilefontsize:0;\"><i class=\"fa fa-user-circle\" style=\"color:#f2f2f2;margin-right:0.8em;font-size:1em;transform:translateY( -0.125em );\"><\/i>GROUPE DE RECHERCHE : MICROELEC SI<\/ls-layer><\/div><div class=\"ls-slide\" data-ls=\"duration:4000;transition2d:5;\"><img loading=\"lazy\" decoding=\"async\" width=\"2600\" height=\"270\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_trous.jpg\" class=\"ls-bg\" alt=\"\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_trous.jpg 2600w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_trous-300x31.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_trous-768x80.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_trous-1030x107.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_trous-1500x156.jpg 1500w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_trous-705x73.jpg 705w\" sizes=\"auto, (max-width: 2600px) 100vw, 2600px\" \/><ls-layer style=\"font-size:14px;text-align:left;font-style:normal;text-decoration:none;text-transform:none;font-weight:700;letter-spacing:0px;background-position:0% 0%;background-repeat:no-repeat;mix-blend-mode:normal;top:231px;left:0px;height:30px;width:360px;line-height:32px;color:#ffffff;border-radius:6px 6px 6px 6px;padding-left:50px;background-color:rgba(0, 0, 0, 0.57);\" class=\"ls-l ls-ib-icon ls-text-layer\" data-ls=\"minfontsize:0;minmobilefontsize:0;\"><i class=\"fa fa-user-circle\" style=\"color:#f2f2f2;margin-right:0.8em;font-size:1em;transform:translateY( -0.125em );\"><\/i>GROUPE DE RECHERCHE : MICROELEC SI<\/ls-layer><\/div><div class=\"ls-slide\" data-ls=\"duration:4000;transition2d:5;\"><img loading=\"lazy\" decoding=\"async\" width=\"2600\" height=\"270\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_wafer.jpg\" class=\"ls-bg\" alt=\"\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_wafer.jpg 2600w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_wafer-300x31.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_wafer-768x80.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_wafer-1030x107.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_wafer-1500x156.jpg 1500w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn_wafer-705x73.jpg 705w\" sizes=\"auto, (max-width: 2600px) 100vw, 2600px\" \/><ls-layer style=\"font-size:14px;text-align:left;font-style:normal;text-decoration:none;text-transform:none;font-weight:700;letter-spacing:0px;background-position:0% 0%;background-repeat:no-repeat;mix-blend-mode:normal;top:231px;left:0px;height:30px;width:360px;line-height:32px;color:#ffffff;border-radius:6px 6px 6px 6px;padding-left:50px;background-color:rgba(0, 0, 0, 0.57);\" class=\"ls-l ls-ib-icon ls-text-layer\" data-ls=\"minfontsize:0;minmobilefontsize:0;\"><i class=\"fa fa-user-circle\" style=\"color:#f2f2f2;margin-right:0.8em;font-size:1em;transform:translateY( -0.125em );\"><\/i>GROUPE DE RECHERCHE : MICROELEC SI<\/ls-layer><\/div><div class=\"ls-slide\" data-ls=\"duration:4000;transition2d:5;\"><img loading=\"lazy\" decoding=\"async\" width=\"2600\" height=\"270\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn.jpg\" class=\"ls-bg\" alt=\"\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn.jpg 2600w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn-300x31.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn-768x80.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn-1030x107.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn-1500x156.jpg 1500w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2018\/04\/groupe_microelecsi_iemn-705x73.jpg 705w\" sizes=\"auto, (max-width: 2600px) 100vw, 2600px\" \/><ls-layer style=\"font-size:14px;text-align:left;font-style:normal;text-decoration:none;text-transform:none;font-weight:700;letter-spacing:0px;background-position:0% 0%;background-repeat:no-repeat;mix-blend-mode:normal;top:231px;left:0px;height:30px;width:360px;line-height:32px;color:#ffffff;border-radius:6px 6px 6px 6px;padding-left:50px;background-color:rgba(0, 0, 0, 0.57);\" class=\"ls-l ls-ib-icon ls-text-layer\" data-ls=\"minfontsize:0;minmobilefontsize:0;\"><i class=\"fa fa-user-circle\" style=\"color:#f2f2f2;margin-right:0.8em;font-size:1em;transform:translateY( -0.125em );\"><\/i>GROUPE DE RECHERCHE : MICROELEC SI<\/ls-layer><\/div><\/div><\/div>\n<div id='sub_menu1'  class='av-submenu-container av-jrqfadqy-ce2f2ab09b07c9cd48b0b2cdd423b7d9 footer_color  avia-builder-el-1  el_after_av_layerslider  el_before_av_one_full  submenu-not-first container_wrap sidebar_right' style='z-index:301' ><div class='container av-menu-mobile-disabled av-submenu-pos-left'><ul id='av-custom-submenu-1' class='av-subnav-menu' role='menu'>\n<li class='menu-item av-33xssw8-f1e26adf02799e113cb4188608b5f828 menu-item-top-level menu-item-top-level-1' role='menuitem'><a href='https:\/\/www.iemn.fr\/en\/la-recherche\/les-groupes\/microelecsi'  ><span class='avia-bullet'><\/span><span class='avia-menu-text'>Introduction<\/span><\/a><\/li>\n<li class='menu-item av-2kra9hk-89e3ad2b23f60ce2a7151cea220f9d34 menu-item-top-level menu-item-top-level-2' role='menuitem'><a href='https:\/\/www.iemn.fr\/en\/la-recherche\/les-groupes\/microelecsi\/team-members'  ><span class='avia-bullet'><\/span><span class='avia-menu-text'>Team members<\/span><\/a><\/li>\n<li class='menu-item av-2ag0cnc-cdd2951c9235f9b72c65995d94351bc7 menu-item-top-level menu-item-top-level-3' role='menuitem'><a href='https:\/\/www.iemn.fr\/en\/la-recherche\/les-groupes\/microelecsi\/research-projects'  ><span class='avia-bullet'><\/span><span class='avia-menu-text'>Research projects<\/span><\/a><\/li>\n<li class='menu-item av-1iiwd6w-0a98e099ff2175faa3fbd18e6ac29204 menu-item-top-level menu-item-top-level-4' role='menuitem'><a href='https:\/\/www.iemn.fr\/en\/la-recherche\/les-groupes\/microelecsi\/publications'  ><span class='avia-bullet'><\/span><span class='avia-menu-text'>Publications<\/span><\/a><\/li>\n<li class='menu-item av-qseajs-d2c2e98550f8f4af839903cbf59f954b menu-item-top-level menu-item-top-level-5' role='menuitem'><a href='https:\/\/www.iemn.fr\/en\/la-recherche\/les-groupes\/microelecsi\/positions'  ><span class='avia-bullet'><\/span><span class='avia-menu-text'>Positions<\/span><\/a><\/li>\n<li class='menu-item av-pyte2w-2fd06eb1ed01fdaa9930c51a92c6a5c1 menu-item-top-level menu-item-top-level-6' role='menuitem'><a href='https:\/\/www.iemn.fr\/en\/la-recherche\/les-groupes'  ><span class='avia-bullet'><\/span><span class='avia-menu-text'>Other groups<\/span><\/a><\/li>\n<\/ul><\/div><\/div><div id='after_submenu_1'  class='main_color av_default_container_wrap container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-16680'><div class='entry-content-wrapper clearfix'>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-sd71ns-e6d20563292051c80b0ddb2dbe2e5688\">\n.flex_column.av-sd71ns-e6d20563292051c80b0ddb2dbe2e5688{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-sd71ns-e6d20563292051c80b0ddb2dbe2e5688 av_one_full  avia-builder-el-2  el_after_av_submenu  avia-builder-el-no-sibling  first flex_column_div av-zero-column-padding'     ><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-nl0hig-0ed196c4448c482c39200b4106ef68dd\">\n#top .av-special-heading.av-nl0hig-0ed196c4448c482c39200b4106ef68dd{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-nl0hig-0ed196c4448c482c39200b4106ef68dd .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-nl0hig-0ed196c4448c482c39200b4106ef68dd .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-nl0hig-0ed196c4448c482c39200b4106ef68dd av-special-heading-h2  avia-builder-el-3  el_before_av_textblock  avia-builder-el-first  av-linked-heading'><h2 class='av-special-heading-tag'  itemprop=\"headline\"  >MICROELEC Silicon Group <\/h2><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div><br \/>\n<section  class='av_textblock_section av-6hi9yh4-853c36c8f34f854fd8f34010c9f6df4c'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><blockquote>\n<h3>WELCOME TO THE SILICON MICROELECTRONICS GROUP AT IEMN<\/h3>\n<\/blockquote>\n<p>The group brings together researchers, staff and students working in the following two areas:<\/p>\n<p style=\"padding-left: 40px\">i) Design of integrated circuits for communication systems and artificial intelligence<\/p>\n<p style=\"padding-left: 40px\">ii) Functional packaging and integrated micro-thermics<\/p>\n<h3><strong>Design of integrated circuits for communication systems and artificial intelligence<\/strong><\/h3>\n<p>On the one hand, we design and demonstrate new high-performance, low-power, highly integrated communication systems based on CMOS technologies. This involves designing circuits and systems for a wide range of frequency bands (RF to mmW), as well as for various communication standards, such as Bluetooth, Wi-Fi, cellular and satellite, or non-standardised protocols. This is illustrated by our work on high-speed, low-power capacitive communications coupled to the human body (see portfolio). We are also developing integrated ultra-low-power architectures to provide hardware solutions for artificial intelligence at the extreme edge. We are focusing on demonstrating new breakthrough concepts such as event-driven signal processing, in-memory computing, hardware implementation of ultra-low-power machine learning algorithms and neuromorphic processors with non-volatile memories. The applications envisaged include the processing of audio signals (recognition of key words and sounds), biomedical signals (detection of cardiac arrhythmia or sleep apnoea) or movement (detection of falls or fine movements).  The concepts developed are based on advanced industrial CMOS technologies (28nm and 18nm FDSOI CMOS).<\/p>\n<\/div><\/section><br \/>\n<div  class='togglecontainer av-m0p57wav-154d235e9dd5267596e0785ab629d75a  avia-builder-el-5  el_after_av_textblock  el_before_av_textblock  toggle_close_all' >\n<section class='av_toggle_section av-av_toggle-b4659410dbe2d901ff056d01b1d6b62e'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div role=\"tablist\" class=\"single_toggle\" data-tags=\"{All} \"  ><p id='toggle-toggle-id-1' data-fake-id='#toggle-id-1' class='toggler  av-title-above'  itemprop=\"headline\"  role='tab' tabindex='0' aria-controls='toggle-id-1' data-slide-speed=\"200\" data-title=\"Digital transmitter architecture for RF applications\" data-title-open=\"Digital RF transmitters\" data-aria_collapsed=\"Click to expand: Digital transmitter architecture for RF applications\" data-aria_expanded=\"Click to collapse: Digital transmitter architecture for RF applications\">Digital transmitter architecture for RF applications<span class=\"toggle_icon\"><span class=\"vert_icon\"><\/span><span class=\"hor_icon\"><\/span><\/span><\/p><div id='toggle-id-1' aria-labelledby='toggle-toggle-id-1' role='region' class='toggle_wrap  av-title-above'  ><div class='toggle_content invers-color'  itemprop=\"text\" ><p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Digital-RF-transmitters.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-large wp-image-70176 aligncenter\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Digital-RF-transmitters-1030x579.jpg\" alt=\"\" width=\"1030\" height=\"579\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Digital-RF-transmitters-1030x579.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Digital-RF-transmitters-300x169.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Digital-RF-transmitters-768x432.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Digital-RF-transmitters-18x10.jpg 18w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Digital-RF-transmitters-705x397.jpg 705w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Digital-RF-transmitters.jpg 1280w\" sizes=\"auto, (max-width: 1030px) 100vw, 1030px\" \/><\/a><\/p>\n<\/div><\/div><\/div><\/section>\n<section class='av_toggle_section av-av_toggle-3f1ae5568796fcca0fc8c763c66577dc'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div role=\"tablist\" class=\"single_toggle\" data-tags=\"{All} \"  ><p id='toggle-toggle-id-2' data-fake-id='#toggle-id-2' class='toggler  av-title-above'  itemprop=\"headline\"  role='tab' tabindex='0' aria-controls='toggle-id-2' data-slide-speed=\"200\" data-title=\"Body-coupled communications\" data-title-open=\"\" data-aria_collapsed=\"Click to expand: Body-coupled communications\" data-aria_expanded=\"Click to collapse: Body-coupled communications\">Body-coupled communications<span class=\"toggle_icon\"><span class=\"vert_icon\"><\/span><span class=\"hor_icon\"><\/span><\/span><\/p><div id='toggle-id-2' aria-labelledby='toggle-toggle-id-2' role='region' class='toggle_wrap  av-title-above'  ><div class='toggle_content invers-color'  itemprop=\"text\" ><p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Body-coupled-communications.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-large wp-image-70175 aligncenter\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Body-coupled-communications-1030x579.jpg\" alt=\"\" width=\"1030\" height=\"579\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Body-coupled-communications-1030x579.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Body-coupled-communications-300x169.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Body-coupled-communications-768x432.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Body-coupled-communications-18x10.jpg 18w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Body-coupled-communications-705x397.jpg 705w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Body-coupled-communications.jpg 1280w\" sizes=\"auto, (max-width: 1030px) 100vw, 1030px\" \/><\/a><\/p>\n<\/div><\/div><\/div><\/section>\n<section class='av_toggle_section av-av_toggle-83946e5a59953d798da9f6a4befe84a9'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div role=\"tablist\" class=\"single_toggle\" data-tags=\"{All} \"  ><p id='toggle-toggle-id-3' data-fake-id='#toggle-id-3' class='toggler  av-title-above'  itemprop=\"headline\"  role='tab' tabindex='0' aria-controls='toggle-id-3' data-slide-speed=\"200\" data-title=\"On-chip neural networks for near-sensor computing \/ Edge AI\" data-title-open=\"\" data-aria_collapsed=\"Click to expand: On-chip neural networks for near-sensor computing \/ Edge AI\" data-aria_expanded=\"Click to collapse: On-chip neural networks for near-sensor computing \/ Edge AI\">On-chip neural networks for near-sensor computing \/ Edge AI<span class=\"toggle_icon\"><span class=\"vert_icon\"><\/span><span class=\"hor_icon\"><\/span><\/span><\/p><div id='toggle-id-3' aria-labelledby='toggle-toggle-id-3' role='region' class='toggle_wrap  av-title-above'  ><div class='toggle_content invers-color'  itemprop=\"text\" ><p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-On-chip-neural-networks.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-large wp-image-70174 aligncenter\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-On-chip-neural-networks-1030x579.jpg\" alt=\"\" width=\"1030\" height=\"579\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-On-chip-neural-networks-1030x579.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-On-chip-neural-networks-300x169.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-On-chip-neural-networks-768x432.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-On-chip-neural-networks-18x10.jpg 18w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-On-chip-neural-networks-705x397.jpg 705w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-On-chip-neural-networks.jpg 1280w\" sizes=\"auto, (max-width: 1030px) 100vw, 1030px\" \/><\/a><\/p>\n<\/div><\/div><\/div><\/section>\n<section class='av_toggle_section av-m0p57uzz-ad3a88df1552331c3f3c0067c8163aeb'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div role=\"tablist\" class=\"single_toggle\" data-tags=\"{All} \"  ><p id='toggle-toggle-id-4' data-fake-id='#toggle-id-4' class='toggler  av-title-above'  itemprop=\"headline\"  role='tab' tabindex='0' aria-controls='toggle-id-4' data-slide-speed=\"200\" data-title=\"Event-driven signal processing for in-sensor feature extraction \" data-title-open=\"\" data-aria_collapsed=\"Click to expand: Event-driven signal processing for in-sensor feature extraction \" data-aria_expanded=\"Click to collapse: Event-driven signal processing for in-sensor feature extraction \">Event-driven signal processing for in-sensor feature extraction <span class=\"toggle_icon\"><span class=\"vert_icon\"><\/span><span class=\"hor_icon\"><\/span><\/span><\/p><div id='toggle-id-4' aria-labelledby='toggle-toggle-id-4' role='region' class='toggle_wrap  av-title-above'  ><div class='toggle_content invers-color'  itemprop=\"text\" ><p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Event-driven-signal.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-large wp-image-70177 aligncenter\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Event-driven-signal-1030x579.jpg\" alt=\"\" width=\"1030\" height=\"579\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Event-driven-signal-1030x579.jpg 1030w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Event-driven-signal-300x169.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Event-driven-signal-768x432.jpg 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Event-driven-signal-18x10.jpg 18w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Event-driven-signal-705x397.jpg 705w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/0-Event-driven-signal.jpg 1280w\" sizes=\"auto, (max-width: 1030px) 100vw, 1030px\" \/><\/a><\/p>\n<\/div><\/div><\/div><\/section>\n<\/div><br \/>\n<section  class='av_textblock_section av-5b9e5ns-60d2d5681effc2e0a8bd34e0f47f6dcd'   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><hr \/>\n<h3><strong>Functional packaging and integrated micro-thermics<br \/>\n<\/strong><\/h3>\n<p>For 10 years now, the group has been focusing on two complementary areas to meet the challenges of microelectronics: i) functional packaging, which responds to the increasing complexity of heterogeneous assemblies, particularly in the RF and mmW fields ii) studying the limitations and opportunities associated with managing heat flows in circuits and systems.<\/p>\n<p>Functional packaging aims to develop advanced heterogeneous integration solutions in line with the 'System Moore' paradigm, according to which significant performance and compactness margins can be gained by assembling sub-systems. For example, by integrating mmW and optical waveguides on an interposer, functional packaging enables mmW chips and photonic chips to be embedded and connected on the same heterogeneous assembly platform for the synthesis of electro-optical transceivers. This activity also covers the implementation of chips in the D, G and J band spectrum (110 to 320 GHz), which requires the development of complex packages in order to limit losses linked to propagation and mode transitions. This area of research relies in particular on the use of laser micromachining techniques (EQUIPEX LEAF) to address dimensions ranging from the micron to the millimetre, compatible with the dimensions of waveguides in the bands concerned. (see portfolio noise source)<\/p>\n<p>Heat transfer limits the performance of the most integrated technologies. This problem is exacerbated by the highly heterogeneous and truly nanometric assemblies of materials in components. On the other hand, heat has become an operational resource for certain components (phase-change memories, thermo-optic modulation, RF switches). Our aim is to contribute to the modelling, manufacture and thermal and electrical characterisation of materials and components. In addition to Raman thermometry, near-field thermal microscopy and the 3\u03a9 method, the instrumentation project currently under development is based on the acquisition of a time-resolved (50 ns), multi-wavelength thermo-reflectance bench capable of measuring temperature transients on a wide variety of microelectronic systems.<\/p>\n<\/div><\/section><br \/>\n<div  class='togglecontainer av-m0o1xyyk-ae92d560c9efa05653e9f725cb448304  avia-builder-el-7  el_after_av_textblock  avia-builder-el-last  toggle_close_all' >\n<section class='av_toggle_section av-1qmvc94-2e9d0f0265d9cfb9859f6654782133fc'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div role=\"tablist\" class=\"single_toggle\" data-tags=\"{All} \"  ><p id='toggle-toggle-id-5' data-fake-id='#toggle-id-5' class='toggler  av-title-above'  itemprop=\"headline\"  role='tab' tabindex='0' aria-controls='toggle-id-5' data-slide-speed=\"200\" data-title=\"Packaging de sondes actives int\u00e9gr\u00e9es en bande millim\u00e9trique\" data-title-open=\"\" data-aria_collapsed=\"Click to expand: Packaging de sondes actives int\u00e9gr\u00e9es en bande millim\u00e9trique\" data-aria_expanded=\"Click to collapse: Packaging de sondes actives int\u00e9gr\u00e9es en bande millim\u00e9trique\">Packaging of integrated active millimetre-band probes<span class=\"toggle_icon\"><span class=\"vert_icon\"><\/span><span class=\"hor_icon\"><\/span><\/span><\/p><div id='toggle-id-5' aria-labelledby='toggle-toggle-id-5' role='region' class='toggle_wrap  av-title-above'  ><div class='toggle_content invers-color'  itemprop=\"text\" ><p>Advanced silicon technologies (BiCMOS B55 STMicroelectronics) targeting cut-off frequencies f<sub>T<\/sub>\/f<sub>max<\/sub> above 400GHz will enable the design of silicon circuits in the 140-220GHz frequency range (G-band). In order to validate the development of these technologies, microwave characterisation resources are needed to extract transistor merit factors such as noise figure and power efficiency, and to develop the associated modelling. At these frequencies, broadband tools such as noise sources, noise receivers, impedance adapters (tuners) and power receivers are not currently available on the market to meet this demand. Previous thesis work has demonstrated the possibility of implementing these functions by embedding them directly on silicon around the device to be tested in BiCMOS B55 technology. This test approach <em>in-situ<\/em> or <em>built-in self test (BIST)<\/em> is not, however, a viable solution because it consumes a substantial amount of silicon, resulting in an unacceptable cost.<\/p>\n<p>In order to take advantage of measurement instrumentation for a range of technologies beyond just the B55 process, and to rationalise the costs associated with testing, the next step is to design the integration of these functions into a compact system positioned as close as possible to the measurement peaks. The proximity of the instrumentation function (e.g. noise source) to the immediate vicinity of the tip is made necessary in order to control losses, variations in which drastically alter the measurement sensitivity (MDS - minimum detectable signal) and the impedance constellation at the input of the component to be measured.<\/p>\n<p>This measurement system must be produced using a packaging technology that integrates the manufacture of the tips in order to test the components directly on the silicon wafers. This instrumentation system therefore takes the form of a functionalized active probe requiring the implementation of a waveguide technology similar to that described in the previous section. This research theme has given rise to initial developments, illustrated below, explaining the manufacture and measurement of elementary technological building blocks, as well as the implementation strategy for this type of probe.<\/p>\n<p style=\"text-align: center\"><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1.gif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-66295\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1-878x1030.gif\" alt=\"\" width=\"878\" height=\"1030\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1-878x1030.gif 878w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1-256x300.gif 256w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1-768x901.gif 768w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1-1310x1536.gif 1310w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1-10x12.gif 10w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1-1279x1500.gif 1279w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/06\/Fig-Packaging-1-601x705.gif 601w\" sizes=\"auto, (max-width: 878px) 100vw, 878px\" \/><\/a><\/p>\n<\/div><\/div><\/div><\/section>\n<section class='av_toggle_section av-m0o1xx4w-6d33fe9480cebf5ce23b1ba6e77e6fef'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div role=\"tablist\" class=\"single_toggle\" data-tags=\"{All} \"  ><p id='toggle-toggle-id-6' data-fake-id='#toggle-id-6' class='toggler  av-title-above'  itemprop=\"headline\"  role='tab' tabindex='0' aria-controls='toggle-id-6' data-slide-speed=\"200\" data-title=\"Interposeur \u00e9lectro-optique pour communication haut-d\u00e9bit 400Gb\/s \" data-title-open=\"\" data-aria_collapsed=\"Click to expand: Interposeur \u00e9lectro-optique pour communication haut-d\u00e9bit 400Gb\/s \" data-aria_expanded=\"Click to collapse: Interposeur \u00e9lectro-optique pour communication haut-d\u00e9bit 400Gb\/s \">Electro-optical interposer for 400Gb\/s high-speed communication <span class=\"toggle_icon\"><span class=\"vert_icon\"><\/span><span class=\"hor_icon\"><\/span><\/span><\/p><div id='toggle-id-6' aria-labelledby='toggle-toggle-id-6' role='region' class='toggle_wrap  av-title-above'  ><div class='toggle_content invers-color'  itemprop=\"text\" ><p>Ce sujet a abord\u00e9 l\u2019\u00e9tude et le d\u00e9veloppement d\u2019un interposeur embarquant des fonctions \u00e9lectriques et optiques int\u00e9gr\u00e9es \u00e0 un substrat de verre avec pour ambition la validation d\u2019un assemblage passif complet de transceiver CWDM bas\u00e9 sur la technologie photonique sur silicium PIC25G de STMicroelectronics. En premier lieu, ce travail a abord\u00e9 la conception et la fabrication des principales fonctions \u00e9l\u00e9mentaires int\u00e9gr\u00e9es \u00e0 l\u2019interposeur, \u00e0 savoir, des guides d\u2019ondes monomodes, des structures de couplage optique vertical et des lignes de transmission fonctionnant \u00e0 des fr\u00e9quences RF \u00e0 mmW. En second lieu, La fonctionnalit\u00e9 de l\u2019interposeur et de l\u2019assemblage complet a \u00e9t\u00e9 d\u00e9montr\u00e9e au travers d\u2019un travail d\u00e9taill\u00e9 de caract\u00e9risations \u00e9lectriques, optiques et mixtes. En termes de m\u00e9triques, nous avons fabriqu\u00e9 un interposeur int\u00e9grant des guides d\u2019ondes avec des pertes de propagation &lt; 6 dB\/cm \u00e0 1310 nm, des lignes de transmission coplanaires de 1\u202fcm avec des pertes d\u2019insertion de 3 dB \u00e0 60 GHz, des miroirs de redirection du signal optique et l\u2019ensemble du routage \u00e9lectrique et optique permettant de tester la d\u00e9tection et la modulation de la lumi\u00e8re par la puce photonique silicium PIC25G. L&rsquo;assemblage de la puce PIC25G sur l&rsquo;interposeur a \u00e9t\u00e9 r\u00e9alis\u00e9 en utilisant une technique classique de flip-chip sans alignement actif. Ces travaux ont d\u00e9montr\u00e9 la viabilit\u00e9 de l\u2019approche d\u2019interposeur verre pour le packaging photonique sur silicium au moyen de techniques d\u2019assemblage conventionnelles dans l\u2019industrie de la micro\u00e9lectronique. Ces travaux entrent dans le cadre du projet EQUIPEX LEAF, du Laboratoire Commun ST-IEMN et du programme de recherche NANO2022.<\/p>\n<p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Interposeur.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-large wp-image-70161 aligncenter\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Interposeur-713x1030.jpg\" alt=\"\" width=\"713\" height=\"1030\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Interposeur-713x1030.jpg 713w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Interposeur-208x300.jpg 208w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Interposeur-8x12.jpg 8w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Interposeur-488x705.jpg 488w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Interposeur.jpg 720w\" sizes=\"auto, (max-width: 713px) 100vw, 713px\" \/><\/a><\/p>\n<\/div><\/div><\/div><\/section>\n<section class='av_toggle_section av-17ioe3s-ca8ad2030eb8f905d303548b07a5d3be'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div role=\"tablist\" class=\"single_toggle\" data-tags=\"{All} \"  ><p id='toggle-toggle-id-7' data-fake-id='#toggle-id-7' class='toggler  av-title-above'  itemprop=\"headline\"  role='tab' tabindex='0' aria-controls='toggle-id-7' data-slide-speed=\"200\" data-title=\"Micro-plateformes de caract\u00e9risation thermique et thermo\u00e9lectrique suspendues en silicium cristallin\" data-title-open=\"\" data-aria_collapsed=\"Click to expand: Micro-plateformes de caract\u00e9risation thermique et thermo\u00e9lectrique suspendues en silicium cristallin\" data-aria_expanded=\"Click to collapse: Micro-plateformes de caract\u00e9risation thermique et thermo\u00e9lectrique suspendues en silicium cristallin\">Suspended crystalline silicon micro-platforms for thermal and thermoelectric characterisation<span class=\"toggle_icon\"><span class=\"vert_icon\"><\/span><span class=\"hor_icon\"><\/span><\/span><\/p><div id='toggle-id-7' aria-labelledby='toggle-toggle-id-7' role='region' class='toggle_wrap  av-title-above'  ><div class='toggle_content invers-color'  itemprop=\"text\" ><p>Size reduction in nanosctructures has a strong impact on thermal conductivity <em>via<\/em> reducing the mean free path of phonons. This effect can be exploited to artificially enhance the thermoelectric properties of materials. This idea was deployed as part of the UPTEG ERC and via three CIFRES theses as part of the STMicroelectronics-IEMN joint laboratory. We have developed suspension processes for crystalline silicon structures (membranes, phononic structures, nanowires) equipped with thermoresistive elements. The thermal and thermoelectric metrology of such objects remains a challenge. We were thus able to quantify the reduction in thermal conductivity and produce a demonstrator of an integrated thermoelectric converter.  More recently, as part of Hafsa Ikzibane's thesis, we were able to quantify the thermoelectric properties of ultra-thin membranes (60 nm) and the impact of a nano-porous structure. Finally, these processes are currently being used as part of the ANR HANIBAL project to design superconducting thermal sensors to study heat transfer in the quantum regime.<\/p>\n<p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-Thermique.tif\"><img decoding=\"async\" class=\"alignnone size-full wp-image-70143\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-Thermique.tif\" alt=\"\" \/><\/a><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-MicroTherm.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-large wp-image-70148 aligncenter\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-MicroTherm-713x1030.jpg\" alt=\"\" width=\"713\" height=\"1030\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-MicroTherm-713x1030.jpg 713w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-MicroTherm-208x300.jpg 208w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-MicroTherm-8x12.jpg 8w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-MicroTherm-488x705.jpg 488w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Microplateforme-MicroTherm.jpg 720w\" sizes=\"auto, (max-width: 713px) 100vw, 713px\" \/><\/a><\/p>\n<\/div><\/div><\/div><\/section>\n<section class='av_toggle_section av-jktaso-f7be3de2ee6fb6fd6084f681647bb5b6'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div role=\"tablist\" class=\"single_toggle\" data-tags=\"{All} \"  ><p id='toggle-toggle-id-8' data-fake-id='#toggle-id-8' class='toggler  av-title-above'  itemprop=\"headline\"  role='tab' tabindex='0' aria-controls='toggle-id-8' data-slide-speed=\"200\" data-title=\"Mod\u00e9lisation et m\u00e9trologie thermique pour les composants \u00e0 changement de phase\" data-title-open=\"\" data-aria_collapsed=\"Click to expand: Mod\u00e9lisation et m\u00e9trologie thermique pour les composants \u00e0 changement de phase\" data-aria_expanded=\"Click to collapse: Mod\u00e9lisation et m\u00e9trologie thermique pour les composants \u00e0 changement de phase\">Modelling and thermal metrology for phase-change components<span class=\"toggle_icon\"><span class=\"vert_icon\"><\/span><span class=\"hor_icon\"><\/span><\/span><\/p><div id='toggle-id-8' aria-labelledby='toggle-toggle-id-8' role='region' class='toggle_wrap  av-title-above'  ><div class='toggle_content invers-color'  itemprop=\"text\" ><p>Heat transfer limits the performance of the most integrated technologies. This problem is exacerbated by the highly heterogeneous and truly nanometric assemblies of materials in components. On the other hand, heat has become an operational resource for certain components (phase-change memories, thermo-optic modulation, RF switches). Our aim is to contribute to the modelling, manufacture and thermal and electrical characterisation of materials and components. To do this, we use Raman thermometry, near-field thermal microscopy and the 3\u03c9 method. The instrumentation project currently under development is based on the acquisition of a time-resolved (50 ns), multi-wavelength thermo-reflectance bench capable of measuring temperature transients on a wide variety of microelectronic systems. Two representative examples of this activity are: i) the Raman thermometry study of germanium-enriched GeSbTe, a phase-change material at the heart of memory technologies. (Cifre thesis STMicroelectronics - Akash Patil). ii) Thermal modelling of RF switches for 5G using a GeTe RF channel (Cifre thesis STmicroelectronics - CEA Leti -IEMN by Corentin Mercier).<\/p>\n<p><a href=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Metrologie-PCM.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70155 aligncenter\" src=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Metrologie-PCM.jpg\" alt=\"\" width=\"715\" height=\"584\" srcset=\"https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Metrologie-PCM.jpg 715w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Metrologie-PCM-300x245.jpg 300w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Metrologie-PCM-15x12.jpg 15w, https:\/\/www.iemn.fr\/wp-content\/uploads\/2024\/09\/Metrologie-PCM-705x576.jpg 705w\" sizes=\"auto, (max-width: 715px) 100vw, 715px\" \/><\/a><\/p>\n<\/div><\/div><\/div><\/section>\n<\/div><\/p><\/div>","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"parent":101,"menu_order":60,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-16680","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/pages\/16680","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/comments?post=16680"}],"version-history":[{"count":0,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/pages\/16680\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/pages\/101"}],"wp:attachment":[{"href":"https:\/\/www.iemn.fr\/en\/wp-json\/wp\/v2\/media?parent=16680"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}