Along with conventional vacuum deposition techniques, CMNF has also invested in alternative techniques in recent years.

Indeed, we perform localized deposits by direct writing using inkjet printing technology, a technique that is still not widespread in the Renatech network. Our machine is equipped with a three-head printing column, two multi-nozzle heads (128 nozzles) and a single-nozzle head, allowing us to gain in printing speed and the realization of complex patterns. We use it in two main fields of application which are:

-flexible electronics with the realization of components and active or passive circuits

-biology with semi-reflective coatings for the detection of enzymatic activities

In addition, we are developing electrochemical deposits of gold and copper for thick deposits not achievable by evaporation or sputtering.

Know-how: some highlights

- Transistors in graphene or carbon nanotube technology (formulated by Cambridge) by inkjet printing

1. Graphene Field Effect Transistors (carbon group), graphene ink channel, Ag ink electrodes, Parylene C dielectric processed by SF6 plasma.

- Developing passive devices on flexible materials by inkjet printing

2. Passive device on flexible, 1µm thick, Annealing : 150°C 40min (Carbon group)

- Matrix organization of biomedical sensors on flexible substrate

3. Device on flexible: 1µm thick, line width 200µm, rruns : 150°C 40min. (CSAM group)


- Electrolysis of Au and Cu for the realization of thick layers (a few µm to several hundred µm) for thickening purposes, air bridges, ... Depositions are possible in direct or pulsed current, in full plates or localized through a resin mask.

Transistors HEMT multi-doigts Réalisation : pont à air avec 3.5 µm d'électrolyse Au

4. Realization of an air bridge with 3.5 µm Au electrolysis on a multi-finger HEMT (GaN theme)